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Discontinued
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P4SP(0.4mm pitch)

Features

  • Capable of Max. 5 A for power
    Rated current 1 A/pin (for power) 0.5A/pin (for signal), Total: Max. 12A

  • Any terminal can be applied for power terminal

  • Low contact resistance: Max. 40mΩ

  • High speed transmission of 10Gbps is available

Applications

  • DSC, mobile devices and industrial equipment

 

Characteristics

Item Specifications Conditions
Electrical
characteristics
Rated
current
Power terminal  
Signal terminal As power contact: 1.0A/pin contact × 10 pins
As signal contact: 0.5A/pin contact
(Max. 12A at total pin contacts)
 
Rated voltage 30V AC/DC  
Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute.
Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.)
Contact resistance Max. 40mΩ Based on the contact resistance measurement method specified by JIS C 5402.
Mechanical
characteristics
Composite insertion force Max. 0.981N/pin contact × pin contacts (initial)  
Composite removal force Min. 0.0588N/pin contact × pin contacts  
Environmental
characteristics
Ambient temperature –55 to +85°C No icing. No condensation.
Soldering heat resistance The initial specification must be satisfied electrically and mechanically. Reflow soldering: Peak temperature: 260°C or less
(on the surface of the PC board around the connector terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
Storage temperature –55 to +85°C (product only)
–40 to +50°C (emboss packing)
No icing. No condensation.
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 40mΩ
Conformed to MIL-STD-202F, method 107G
MIL-STD-202F METHOD 107G Order/Temperature/Time
Humidity resistance
(header and socket mated)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 40mΩ
Conformed to IEC60068-2-78
Temperature 40±2°C, humidity 90 to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 40mΩ
Conformed to IEC60068-2-11
Temperature 35±2°C, saltwater concentration 5±1%
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 40mΩ
Temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics
Insertion and removal life 50 times Repeated insertion and removal speed of max. 200 times/hours
Unit weight 20 pins Socket: 0.04 g
20 pins Header: 0.02 g
 

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Material and surface treatment

Part name Material Surface treatment
Molded portion LCP resin (UL94V-0)
Contact and Post Copper alloy Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers
(exposed nickel portions).
Soldering terminals Copper alloy Sockets:
 Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips)
Headers:
 Base: Ni plating, Surface: Au plating (except the terminal tips)

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