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Discontinued
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S35H(0.35mm pitch)

Features

  • Small size (0.6 mm Mated Height with 1.7 mm width)

  • Increased robustness with metal shell construction on the flange

  • Supports 5.4 A power terminal for reduced number of power line pins

  • “TOUGH CONTACT” construction provides resistant to various environmental conditions.

Applications

  • Wearable devices and smartphones

 

Characteristics

Item Specifications Conditions
Electrical
characteristics
Rated
current
Power terminal 5.4A/pin contact  
Signal terminal 0.3A/pin contact (Max. 2 A at total pin contacts)  
Rated voltage 30V AC/DC  
Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute.
Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.)
Contact resistance Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal)
Based on the contact resistance measurement method specified by JIS C 5402.
Mechanical
characteristics
Composite insertion force Max. 1.300N/pin contacts × pin contacts (initial)  
Composite removal force Min. 0.165N/pin contacts × pin contacts  
Environmental
characteristics
Ambient temperature –55°C to +85°C Includes heat from connector.
No icing or condensation.
Soldering heat resistance The initial specification must be satisfied electrically and mechanically Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector terminals)
Soldering iron: 300°C within 5 sec., 350°C within 3 sec.
Storage temperature –55 to +85°C (product only)
–40 to +50°C (emboss packing)
No icing or condensation.
Thermal shock resistance
(header and socket mated)
5 cycles
insulation resistance: min. 100MΩ
contact resistance:
 max. 30mΩ (power terminal)
 max. 90mΩ (signal terminal)
Conformed to MIL-STD-202F, method 107G
MIL-STD-202F METHOD 107G Order/Temperature/Time
Humidity resistance
(header and socket mated)
120 hours
insulation resistance: min. 100MΩ
contact resistance:
 max. 30mΩ (power terminal)
 max. 90mΩ (signal terminal)
Conformed to IEC60068-2-78
Temperature 40±2°C, humidity 90 to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours
insulation resistance: min. 100MΩ
contact resistance:
 max. 30mΩ (power terminal)
 max. 90mΩ (signal terminal)
Conformed to IEC60068-2-11
Temperature 35±2°C, saltwater concentration 5±1%
H2S resistance
(header and socket mated)
48 hours
contact resistance:
 max. 30mΩ (power terminal)
 max. 90mΩ (signal terminal)
Temperature 40±2°C, gas concentration 3 ±1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics
Insertion and removal life 30 times Repeated insertion and removal speed of max. 200 times/hours
Unit weight 34 pins: Socket 0.01g
34 pins: Header 0.01g
 

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Material and surface treatment

Part name Material Surface treatment
Molded portion LCP resin (UL94V-0)
Contact and Post
Power terminals
Copper alloy Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals Copper alloy Sockets:
Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips)

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