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Discontinued
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Y5BH(0.5mm pitch)

Features

  • Differential impedance matching (85Ω, 90Ω) compliant with various high-speed transmission standards.

  • 0.5 mm pitch, 1.8 mm height and double top and bottom contact construction.

  • Supports USB 3.1 Gen. 2 high-speed transmission standard (Transmission speed: up to 10 Gbps)*

    *Universal serial Bus 3.1 Specification Reversion 1.0

  • Contributes to customer cost savings by using impedance matching FFC.

Applications

  • Electronic devices such as PCs, laptop, tablet PCs, DSC, DVC and TV.

 

Characteristics

The followings show specifications, when using an applicable FPC (thickness 0.30 mm)

Item Specifications Conditions
Electrical
characteristics
Rated current 0.4A/pin contact  
Rated voltage 50V AC/DC  
Dielectric strength 250V AC for 1 min. No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute.
Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.)
Contact resistance Max. 100mΩ Based on the contact resistance measurement method specified by JIS C 5402.
Differential impedance 85Ω±10Ω (Connector part)
90Ω±10Ω (Connector part)
Differential signal
Rise times (Tr): 40 ps (20 to 80%)
(FPC and PC board: Differential impedance 85Ω or 90Ω controlled.)
Mechanical
characteristics
FPC/FFC holding force Min. 0.10N/pin contact × pin contacts (initial) Measurement of the maximum force applied until the inserted compatible FPC is pulled out in the insertion axis direction while the connector lever is closed
Environmental
characteristics
Ambient temperature –55 to +85°C No icing. No condensation.
Soldering heat resistance The initial specification must be satisfied electrically and mechanically. Reflow soldering: Peak temperature: 260°C or less
(on the surface of the PC board around the connector terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
Storage temperature –55 to +85°C (Product only)
–40 to +50°C (Emboss packaging)
No icing. No condensation.
Thermal shock resistance
(with FPC/FFC mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(with FPC/FFC mated)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Conformed to IEC60068-2-78
Temperature 40±2°C, humidity 90 to 95% R.H.
Saltwater spray resistance
(with FPC/FFC mated)
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Conformed to IEC60068-2-11
Temperature 35±2°C, saltwater concentration 5±1%
H2S resistance
(with FPC mated)
48 hours,
contact resistance max. 100mΩ
Temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics
Insertion and removal life 20 times Repeated insertion and removal: min. 10 sec./time
Unit weight 40 pins: 0.26 g  

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Material and surface treatment

Part name Material Surface treatment
Molded portion Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0)
Contact Copper alloy Contact portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating

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