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AXF382700 | B02


B02

*Photo may vary from actual product.

  • RoHS Compliant This product has been confirmed that it does not contain the 6 substances specified in EU RoHS Directive 2011/65/EU and the 4 substances specified in 2015/863/EU.  

Product Number AXF382700
Part Number AXF382700
Details Socket
Product name B02
Features Low 0.7 mm profile, high current capacity (10A), 4 signal pins

As of November 24, 2020
Specifications and design of the products are subject to change without notice for the product improvement.

Spec Detail

Item Specifications
Product Number AXF382700
Part Number AXF382700
Family Name (Head of product No.) AXF3
Socket/Header Socket
Connector Type BOARD-TO-FPC
Applications Smartphones, Tablet PCs, Mobile devices
Number of pins 8
Soldering terminals with
Positioning bosses without
Body length (L mm) 4.85
Body Height (H mm) 0.69
Short width 2.20
Recommended PC board pattern Width (mm) 2.60
Mated height (mm) 0.7
Molded portion material LCP resin (UL94V-0)
Contact and Post Material Copper alloy
Surface treatment material Base: Ni plating Surface: Au plating
Rated current 5.0A/pin contact (Power terminal)
0.3A/pin contact (Signal terminal)
Insulation resistance (Min. MΩ)(Initial) 1000
Dielectric strength 150V AC for 1min.
Contact resistance (Max.mΩ) Power terminal: Max. 16mΩ
Signal terminal: Max. 90mΩ
Insertion and removal life (times) Mechanical life: 30 times
Contact resistance:
Power terminal: Max. 16mΩ
Signal terminal: Max. 90mΩ
Composite removal force: Min. 7N
Soldering heat resistance The initial specification must be satisfied electrically and mechanically
Packing style EMBOSSED TAPE AND PLASTIC REEL
Packing
Inner carton
15,000 pieces (1-reel)
Packing
Outer carton
30,000 pieces

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The other side

B02
Product Number AXF482700
Part Number AXF482700
Details Header
Product name B02

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