AXF482700 | B02

*Photo may vary from actual product.

This product has been confirmed that it does not contain the 6 substances specified in EU RoHS Directive 2011/65/EU and the 4 substances specified in 2015/863/EU. 　
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Product Number	AXF482700
Part Number	AXF482700
Details	Header
Product name	B02
Features	Low 0.7 mm profile, high current capacity ( 10 A ) , 4 signal pins

* “ Product Number ” is ordering part number for non Japanese market. “ Part Number ” is ordering part number for Japanese market.

*	“ Product Number ” is ordering part number for non Japanese market. “ Part Number ” is ordering part number for Japanese market.

As of April 19, 2024
Specifications and design of the products are subject to change without notice for the product improvement.

Spec Detail

Item	Specifications
Product Number	AXF482700
Part Number	AXF482700
Connector Type	BOARD-TO-FPC
Piece Type	2 Pieces type (Header)
Socket/ Header	Header
Applications	Smartphones, Tablet PCs, Mobile devices
Number of pins	8
Mated height (mm)	0.7mm
Packing style	EMBOSSED TAPE AND PLASTIC REEL
Packing Inner carton	15,000 pieces (1-reel)
Packing Outer carton	30,000 pieces
Soldering terminals	with
Positioning bosses	without
Body length (L mm)	4.16
Body Height (H mm)	0.55
Short width	1.80
Recommended PC board pattern Width (mm)	2.20
Rated current	5.0A/pin contact (Power terminal) 0.3A/pin contact (Signal terminal)
Dielectric strength	150V AC for 1min.
Insulation resistance (Min. MΩ)(Initial)	1000
Contact resistance (Max.mΩ)	Power terminal: Max. 16mΩ Signal terminal: Max. 90mΩ
Soldering heat resistance	The initial specification must be satisfied electrically and mechanically
Insertion and removal life (times)	Mechanical life: 30 times Contact resistance: Power terminal: Max. 16mΩ Signal terminal: Max. 90mΩ Composite removal force: Min. 7N
Molded portion material	LCP resin (UL94V-0)
Contact and Post Material	Copper alloy
Surface treatment material	Base: Ni plating Surface: Au plating