AUTOMATION
CONTROLS

Search
Discontinued
Products



Tough Contact

Strong resistance to various enviroments. For Board to Boad and Board to FPC Connection. Narrow-pitch Connector Series.

Constructed for high reliability in various environments, these six connectors will make mobile devices tougher than ever.

Tough against dropping

High contact reliability is a requirement against the shock and vibration that are unavoidable when it comes to use of mobile devices.

Tough against foreign particles and flux!
Patented in Taiwan and Japan.

Even when it comes to ultra-miniature electromechanical parts, the demand is increasing for parts that can be used and stored under various environments.

Tough against corrosive gases!

Since mobile devices are used in various places, the surrounding gas (car exhaust gas, etc.) and sweat from the human body, can affect the contacting parts.

Tough against solder rise!

Improvements to N2 reflow and lead-free solder flux increase wetting characteristic of solder. Also, due to the miniaturization of connectors, solder rising may occur depending on conditions.

Tough against dropping

1.Bellows contact construction improved the ability to withstand twisting and increased resistance to shock of dropping.

High precision curved molding that provides the right amount of spring characteristics for contacts, is made possible through precision metal processing, one of our core technologies. A high-level ability to resist shocks has been made possible. The need to withstand the shock of dropping and twisting during insertion has increased in mobile devices.

Simulation analysis

We analyzed what the ideal spring shape would be to bring the right spring characteristic to the contact, and then precision molded it using precision metal processing, one of our core technologies.

Return to top

Tough against foreign particles and flux!
Patented in Taiwan and Japan.

2.V notch improves contact reliability (resistance to entry of foreign particles).

By using the edge for the contacting part, contact pressure per unit area has been increased. Compared to contacts up to now, the ability to remove flux and foreign particles has increased. Also, the ability to prevent entry of foreign particles before it happens has increased.

  • 2-point contacting
  • Surface contact to edge contact
  • Improved contact movement effect before and after V notch passage
  • The combination of these effects greatly improves contact reliability
    (resistance to entry of foreign matter)

Evaluation example of plastic powder adhered on post contact surface

Return to top

Tough against corrosive gases!

3.Improved resistance to corrosion by gas, etc., due to porosity treatment

This treatment consists of coating surface with a very thin film to seal pinholes in the gold plating. We have developed this porosity treatment technology, which ensures the same contact reliability for thin gold plating as that of thick gold plating.

  • Improvement in resistance to corrosion
  • Improvement in insertion/ removal durability
  • Improvement in contact reliability for digital signals

Return to top

Tough against solder rise!

4.Anti-solder-rise efficiency increased due to Ni barrier.

Exposed nickel is placed on mid part of socket contacts. This contact, while being low in profile, prevents solder rise.

  • Influence of solder controlled in contact and contact spring parts.
  • Solder remains in the terminals and stable fillet mold is possible.

Return to top

0.35mm pitch series

0.4mm pitch series

0.5mm pitch series

Return to top

CONTACT US
BY EMAIL
Please click your area to select country or region



BY PHONE

FAQ