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P4(0.4mm pitch)

Mated heights of 1.5 to 3.5 mm supported with " TOUGH CONTACT " construction to withstand of tough environments.

Socket

Header

: Please refer to "Cautions For Use" in the catalog.

Features

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Mated heights of 1.5 to 3.5 mm is available.
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“TOUGH CONTACT” construction provides high resistance to various environment.
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Pattern wiring is possible on PC board of the connector undersurface.

Applications

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Mobile devices and industrial equipment

Lineup
- A35S(0.35mm pitch) Contributes to device miniaturization and advanced functionality with 2.5 mm width, 0.35 mm pitch and 0.8 mm mated height!
- A4S(0.4mm pitch) Being 2.5 mm in width, it facilitates ever-increasing device miniaturization and advanced functionality!
- F4S(0.4mm pitch) Space-saving design with mated height of 1.0 mm and 3.6 mm width
- P4(0.4mm pitch) Mated heights of 1.5 to 3.5 mm supported with " TOUGH CONTACT " construction to withstand of tough environments.
- P4S(0.4mm pitch) High reliability, space saving type, 1.5 to 3.0 mm mated height
- P4S Shield type(0.4mm pitch) Radiation noise reduced by multi-point ground and shield construction
- P5K/P5KS(0.5mm pitch) Mated heights of 3.0 to 9.0 mm supported with " TOUGH CONTACT " construction provides resistant to various environmental conditions.
- P5KF(0.5mm pitch) 0.5 mm pitch and 1.5 to 2.5 mm mated height available
- R35K(0.35mm pitch) The ultra-small ( width 1.3 mm ) , robust yet high mating force connector that can energize 3 A.
- S35(0.35mm pitch) Excellent contact reliability and mating in a super miniature size ( width 1.7 mm )
CAD data　 Catalogs/Datasheets　　
FAQ

Part Number

Rating/Performance

Dimensions

Characteristics

Item		Specifications	Conditions
Electrical characteristics	Rated current	0.3 A/pin contact (Max. 5 A at total pin contacts)
	Rated voltage	60 V AC/DC
	Dielectric strength	150 V AC for 1 min	Rated voltage is applied for one minute and check for short circuit or damage with a detection current of 1 mA.
	Insulation resistance	Min. 1,000 MΩ (initial)	Using 250 V DC megger (applied for 1 min)
	Contact resistance	Max. 70 mΩ	Based on the contact resistance measurement method specified by JIS C 5402.
Mechanical characteristics	Composite insertion force	[For mated height 1.5 mm] Max. 0.981 N/pin contact x pin contacts [For mated height 2.0 to 3.5 mm] 24 contacts or less: Max. 29.43 N 30 contacts or more: Max. 0.981 N/pin contact x pin contacts
Mechanical characteristics	Composite removal force	[For mated height 1.5 mm] Min. 0.0588 N/pin contact x pin contacts [For mated height 2.0 to 3.5 mm] Min. 0.118 N/pin contact x pin contacts
Environmental characteristics	Ambient temperature	-55 to +85°C	No icing. No condensation.
	Soldering heat resistance	The initial specification must be satisfied electrically and mechanically.	Reflow soldering: Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
	Storage temperature	-55 to +85°C (product only) -40 to +50°C (emboss packing)	No icing. No condensation.
	Thermal shock resistance (header and socket mated)	5 cycles, insulation resistance Min. 100 MΩ, contact resistance Max. 70 mΩ
	Humidity resistance (header and socket mated)	120 hours, insulation resistance Min. 100 MΩ, contact resistance Max. 70 mΩ	Conformed to IEC60068-2-78 Temperature 40±2°C, humidity 90 to 95% RH
	Saltwater spray resistance (header and socket mated)	24 hours, insulation resistance Min. 100 MΩ, contact resistance Max. 70 mΩ	Conformed to IEC60068-2-11 Temperature 35±2°C, saltwater concentration 5±1%
	H₂S resistance (header and socket mated)	48 hours, contact resistance Max. 70 mΩ	Temperature 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% RH
Lifetime characteristics	Insertion and removal life	50 times	Repeated insertion and removal speed of Max. 200 times/hour
Unit weight		Mated height 1.5 mm 20 pins Socket: 0.04 g Header: 0.02 g

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Material and surface treatment

Part name	Material	Surface treatment
Molded portion	LCP resin (UL94V-0)	—
Contact and Post	Copper alloy	Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The terminals of Ni barrier production socket close to the portion to be soldered have nickel barriers (exposed nickel portions).