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A35P(0.35mm pitch)

Space savings and design flexibility are available by supporting high current rating

Socket

Header

: Please refer to "Cautions For Use" in the catalog.

Features

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High current rating 5 A (using 1.25 A/pin × 8 pins)
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By supporting high current rating, small number of pins design is available.
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Increasing design flexibility
(pin layout, high current multiple lines)

Applications

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DSC and other mobile devices
Module connecting part with high power consumption.

Lineup
- A35P(0.35mm pitch) Space savings and design flexibility are available by supporting high current rating
- A35UH(0.35mm pitch) Supports 5 A for power terminal. Reduce number of pins is available.
- B01 Achieved high current capacity (6 A) and high reliability with low profile of 0.6 mm/0.8 mm
- B02 Low 0.7 mm profile, high current capacity (10 A), 4 signal pins
- P4SP(0.4mm pitch) Realized space savings for power line, and increased design flexibility
CAD data　 Catalogs/Datasheets　　
FAQ

Part Number

Rating/Performance

Dimensions

Characteristics

Item			Specifications	Conditions
Electrical characteristics	Rated current	Power contact	—
	Rated current	Signal contact	As power contact: 1.5 A/pin contact × 4 pin contacts or 1.25 A/pin contact × 8 pin contacts As signal contact: 0.5 A/pin contact (Max. 12 A at total pin contacts)
	Rated voltage		30V AC/DC
	Dielectric strength		150V AC for 1 min.	No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute.
	Insulation resistance		Min. 1,000MΩ (initial)	Using 250V DC megger (applied for 1 min.)
	Contact resistance		Max. 30mΩ	Based on the contact resistance measurement method specified by JIS C 5402.
Mechanical characteristics	Composite insertion force		Max. 0.981N/pin contact × pin contacts (initial)
Mechanical characteristics	Composite removal force		Min. 0.165N/pin contact × pin contacts
Environmental characteristics	Ambient temperature		–55 to +85°C	Include the calorification from the connector. No icing. No condensation.
	Soldering heat resistance		The initial specification must be satisfied electrically and mechanically.	Reflow soldering: Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
	Storage temperature		–55 to +85°C (product only) –40 to +50°C (emboss packing)	No icing. No condensation.
	Thermal shock resistance (header and socket mated)		5 cycles, insulation resistance min. 100MΩ, contact resistance max. 30mΩ	Conformed to MIL-STD-202F, method 107G
	Humidity resistance (header and socket mated)		120 hours, insulation resistance min. 100MΩ, contact resistance max. 30mΩ	Conformed to IEC60068-2-78 Temperature 40±2°C, humidity 90 to 95% R.H.
	Saltwater spray resistance (header and socket mated)		24 hours, insulation resistance min. 100MΩ, contact resistance max. 30mΩ	Conformed to IEC60068-2-11 Temperature 35±2°C, saltwater concentration 5±1%
	H₂S resistance (header and socket mated)		48 hours, contact resistance max. 30mΩ	Temperature 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H.
Lifetime characteristics	Insertion and removal life		30 times	Repeated insertion and removal speed of max. 200 times/hours
Unit weight			60 pins Socket 0.03 g Header 0.02 g

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Material and surface treatment

Part name	Material	Surface treatment
Molded portion	LCP resin (UL94V-0)	—
Contact and Post	Copper alloy	Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals	Copper alloy	Sockets: Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating (except the terminal tips)