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B01

Achieved high current capacity ( 6 A ) and high reliability with low profile of 0.6 mm/0.8 mm

Socket

Header

: Please refer to "Cautions For Use" in the catalog.

Features

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High current rating: 6 A (3 A/pin × 4 pins)
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High removal force while miniature and low profile

Applications

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Smartphones, tablet PCs and other mobile devices

Lineup
- A35P(0.35mm pitch) Space savings and design flexibility are available by supporting high current rating
- A35UH(0.35mm pitch) Supports 5 A for power terminal. Reduce number of pins is available.
- B01 Achieved high current capacity ( 6 A ) and high reliability with low profile of 0.6 mm/0.8 mm
- B02 Low 0.7 mm profile, high current capacity ( 10 A ) , 4 signal pins
- P4SP(0.4mm pitch) Realized space savings for power line, and increased design flexibility
- R35(0.35mm pitch) Supports 5 A for power terminal The ultra-small ( width 1.7mm ) high mating force connector
CAD data　 Catalogs/Datasheets　　
FAQ

Part Number

Rating/Performance

Dimensions

Characteristics

Item			Specifications	Conditions
Electrical characteristics	Rated current	Power contact	3.0 A/pin contact
	Rated current	Signal contact	0.3 A/pin contact
	Rated voltage		30 V AC/DC
	Dielectric strength		150 V AC for 1 min	No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute.
	Insulation resistance		Min. 1,000 MΩ (initial)	Using 250 V DC megger (applied for 1 min)
	Contact resistance		Max. 20 mΩ (power terminal) Max. 90 mΩ (signal terminal)	Based on the contact resistance measurement method specified by JIS C 5402.
Mechanical characteristics	Composite insertion force		Max. 40 N
Mechanical characteristics	Composite removal force		Min. 10 N (H: 0.6, initial)
Environmental characteristics	Ambient temperature		-55 to +85°C	Include the calorification from the connector. No icing. No condensation.
	Soldering heat resistance		The initial specification must be satisfied electrically and mechanically	Reflow soldering: Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
	Storage temperature		-55 to +85°C (products only) -40 to +50°C (emboss packing)	No icing. No condensation.
	Thermal shock resistance (Header and socket mated)		5 cycles, insulation resistance Min. 100 MΩ, contact resistance Max. 20 mΩ (power terminal) Max. 90 mΩ (signal terminal)	Conformed to MIL-STD-202F, method 107G
	Humidity resistance (Header and socket mated)		120 hours, insulation resistance Min. 100 MΩ, contact resistance Max. 20 mΩ (power terminal) Max. 90 mΩ (signal terminal)	Conformed to IEC60068-2-78 Temperature 40±2°C humidity 90 to 95% RH
	Saltwater spray resistance (Header and socket mated)		24 hours, insulation resistance Min. 100 MΩ, contact resistance Max. 20 mΩ (power terminal) Max. 90 mΩ (signal terminal)	Conformed to IEC60068-2-11 Temperature 35±2°C saltwater concentration 5±1%
	H₂S resistance (Header and socket mated)		48 hours, contact resistance Max. 20 mΩ (power terminal) Max. 90 mΩ (signal terminal)	Conformed to JEIDA-38-1984 Temperature 40±2°C gas concentration 3±1 ppm, humidity 75 to 80% RH
Lifetime characteristics	Insertion and removal life		Mechanical life 30 times Contact resistance Max. 20 mΩ (power terminal) Max. 90 mΩ (signal terminal) Composite removal force Min. 7 N	Repeated insertion and removal speed of Max. 200 times/hour
Unit weight			6 pins Socket h = 0.6 mm: 0.010 g, h = 0.8 mm: 0.013 g 6 pins Header h = 0.6 mm: 0.004 g, h = 0.8 mm: 0.005 g

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Material and surface treatment

Part name	Material	Surface treatment
Molded portion	LCP resin (UL94V-0)	—
Contact and Post	Copper alloy	Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals	Copper alloy	Sockets: Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips)