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Y5B/Y5BW (0.5mm pitch)

Pitch 0.5 mm, low profile/space saving and double top and bottom contacts construction

: Please refer to "Cautions For Use" in the catalog.

Features

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Double top and bottom contacts construction
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Wiring patterns can be placed under the connector
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Time and effort can be reduced by delivering with lever open
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Lock hold type (Y5BW) with excellent holding force is available (Y5BW: support only FPC)
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Supports high speed transmission standard V-by-One® HS. of THine Electronics, Inc.
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Models that support an ambient temperature of 105°C are also available.
(For more information, please contact our sales representative.)

Applications

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Mobile devices and industrial equipment

Lineup
- Y3B(0.3mm pitch) Slim, pitch 0.3 mm and double top and bottom contacts construction
- Y5B/Y5BW(0.5mm pitch) Pitch 0.5 mm, low profile/space saving and double top and bottom contacts construction
- Y5BH(0.5mm pitch) Impedance matching products with 0.5 mm pitch and high versatility ( for FPC/FFC )
CAD data　 Catalogs/Datasheets　　
FAQ

Part Number

Rating/Performance

Dimensions

Characteristics

The followings show specifications, when using an applicable FPC (thickness 0.30 mm)

Item		Specifications	Conditions
Electrical characteristics	Rated current	0.5 A/pin contact (except for holding contact)
	Rated voltage	50 V AC/DC
	Dielectric strength	250 V AC for 1 min	No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute.
	Insulation resistance	Min. 1,000 MΩ (initial)	Using 250 V DC megger (applied for 1 min)
	Contact resistance	Max. 100 mΩ	Based on the contact resistance measurement method specified by JIS C 5402.
Mechanical characteristics	FPC/FFC holding force	Y5B: Min. 0.2 N/pin contact × pin contacts (initial) Y5BW: Min. 0.2 N/pin contact × pin contacts + 2.0 N (initial)	Measurement of the maximum force applied until the inserted compatible FPC is pulled out in the insertion axis direction while the connector lever is closed
Environmental characteristics	Ambient temperature	–55 to +85°C *	No icing. No condensation.
	Soldering heat resistance	The initial specification must be satisfied electrically and mechanically.	Reflow soldering: Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
	Storage temperature	–55 to +85°C (product only) –40 to +50°C (emboss packing)	No icing. No condensation.
	Thermal shock resistance (with FPC mated)	5 cycles, insulation resistance Min. 100 MΩ, contact resistance Max. 100 mΩ	Conformed to MIL-STD-202F, method 107G
	Humidity resistance (with FPC mated)	120 hours, insulation resistance Min. 100 MΩ, contact resistance Max. 100 mΩ	Conformed to IEC60068-2-78 Temperature 40±2°C, humidity 90 to 95% RH
	Saltwater spray resistance (with FPC mated)	24 hours, insulation resistance Min. 100 MΩ, contact resistance Max. 100 mΩ	Conformed to IEC60068-2-11 Temperature 35±2°C, saltwater concentration 5±1%
	H₂S resistance (with FPC mated)	48 hours, contact resistance Max. 100 mΩ	Temperature 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% RH
Lifetime characteristics	Insertion and removal life	20 times	Repeated insertion and removal: Min. 10 sec./time
Unit weight		Y5B 34 pins: 0.11 g Y5W 32 pins: 0.11 g

* There are also products prepared for -55 to +105°C of use ambient temperature. For details, please contact our sales representative.

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Material and surface treatment

Part name	Material	Surface treatment
Molded portion	Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)	—
Contact	Copper alloy	Contact portion; Base: Ni plating, Surface: Au plating Terminal portion; Base: Ni plating, Surface: Au plating
Holding contact (Only Y5BW)	Copper alloy	Terminal portion; Base: Ni plating, Surface: Au plating
Soldering terminals	Copper alloy	Base: Ni plating, Surface: Au plating