AQV252G | PhotoMOS HE 1 Form A High Capacity (DIP6-pin type)

PhotoMOS HE 1 Form A High Capacity (DIP6-pin type)

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  • RoHS Compliant

Product Number AQV252G
Part Number AQV252G
Details Through hole terminal, Tube packing style, Load voltage:60 V
Product name PhotoMOS HE 1 Form A High Capacity (DIP6-pin type)
Features Capable of 2A to 3A high-frequency load switching

Spec Detail

As of January 25, 2021
Specifications and design of the products are subject to change without notice for the product improvement.

Item Specifications
Product Number AQV252G
Part Number AQV252G
Product name HE 1 Form A High Capacity
Type HE
Package DIP6
Voltage type AC/DC
LED forward current [ IF ] 50 mA
LED reverse voltage [ VR ] 5 V
Peak forward current [ IFP ] 1 A
Power dissipation [ Pin ] 75 mW
Load voltage [ VL ] 60 V
Load current 2.5 A
Continuous load current [ IL ] 2.5 A
Peak load current [ Ipeak ] 6.0 A
Power dissipation [ Pout ] 600 mW
Total power dissipation [ Pt ] 650 mW
I/O isolation voltage [ Viso ] 1,500 Vrms
Ambient temperature: Operating [ Topr ] -40 to +85°C -40 to +185°F
Ambient temperature: Storage [ Tstg ] -40 to +100°C -40 to +212°F
LED operate current (Typical) 0.5 mA
LED operate current (Maximum) 3 mA
LED turn off current (Minimum) 0.2 mA
LED turn off current (Typical) 0.45 mA
LED dropout voltage (Typical) [ VF ] 1.14 V
LED dropout voltage (Maximum) [ VF ] 1.5 V
On resistance (Typical) [ Ron ] 0.08 ohm
ON resistance (Maximum) [ Ron ] 0.12 ohm
Off state leakage current (Maximum) [ ILeak ] 1μA
Over current protection Nothing
Turn on time (Typical) 1.1 ms
Turn on time (Maximum) 5.0 ms
Turn off time (Typical) 0.25 ms
Turn off time (Maximum) 0.5 ms
I/O capacitance (Typical) [ Ciso ] 0.8 pF
I/O capacitance (Maximum) [ Ciso ] 1.5 pF
Initial I/O isolation resistance (Minimum) [ Riso ] 1,000 M ohm
[Recommended operating conditions] LED current [ IF ] Min.: 5 mA, Max.: 30 mA
[Recommended operating conditions] Load voltage [ VL ] Max.: 48 V
[Recommended operating conditions] Continuous load current [ IL ] Max.: 2.5 A
Terminal shape Through hole terminal
Contact arrangement 1 Form A
Packing style Tube packing style
External dimensions
PC board pattern (Bottom view)

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