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Package AAM11 Series for IR LED Module

Highly efficient reflection package for proximity sensor

Sheet (delivered form)
Individual piece (cut shape)
RoHS compliant

Features

1.Realization of small, low-profile reflector package through application of our unique MID* technology (MIPTEC).

* MID (Molded Interconnect Devices): Molded components with an electrical circuit formed on 3D surfaces.

Individual piece: 2.3 × 1.95 × 0.9 mm

<Cross section of package>

Note: LED chip to be prepared and mounted separately by the customer.

2.A concave reflector structure with good directivity and increased light extraction efficiency due to bright plating specifications contributes to decreased module power consumption

* The graph below uses typical values, and details will vary according to the LED chip specifications.

Applications

1.Light projection type Inductive proximity sensor package

• Smartphone display control
• Finder control of single-lens reflex

2.IR LED lighting for surveillance camera

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