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MID Package for infrared ray LED module

High efficiency package with small, low profile reflector construction

Sheet (delivered form)
Individual piece (cut shape)
RoHS compliant

Features

1.Realization of small and low profile package (Height: 0.9 mm)

2.Concave reflector structure with good directivity (our unique MID* technology)

*MID (Molded Interconnect Devices): Molded components with an electrical circuit formed on 3D surfaces.

3.Proprietary bright plating increases light extraction efficiency

4.High efficiency package contributes to reducing power consumption

Detailed Features

1.Realization of small, low-profile reflector package through application of our unique MID* technology (MIPTEC).

* MID (Molded Interconnect Devices): Molded components with an electrical circuit formed on 3D surfaces.

Individual piece: 2.3 × 1.95 × 0.9 mm

<Cross section of package>

Note: LED chip to be prepared and mounted separately by the customer.

2.A concave reflector structure with good directivity and increased light extraction efficiency due to bright plating specifications contributes to decreased module power consumption

Note: The graph below uses typical values, and details will vary according to the LED chip specifications.

Applications

1.Light projection type Inductive proximity sensor package, smartphone display control and finder control of singlelens reflex

2.IR LED lighting for surveillance camera

3.Wearable and hearable devices

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