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MIPTEC 3D Packaging Devices

Fits right in, like you really needed

Catalogs

What's New

April 1, 2013

Package AAM11 Series for Infrared LED Module

Realization of high efficiency package through small and low-profile reflector structure.

Package AAM11
Series
for IR LED Module

Ever wondered designs come true with Panasonic MID technology

Achieve mechanisms designs that were unthinkable using previous methods.

Bend
LED, etc.
When you want to put
a substrate in a
smaller housing
Now you can use
a multi-face
substrate!
Top view
360° irradiation
(4 LEDs required)
Top view
360° irradiation
(3 LEDs required)

Positioning
Boss
Electric wire
Rib
Pin
Optical axis adjustment is required.
Difcult assembly, or assembly
process involves many tasks
Accurate positioning fit!
Improved assembly accuracy!
Reduced assembly labor time!
Optical axis
Lens
Image sensor, etc.
Optical axis
Lens
Image sensor, etc.
Boss

Integrate
Photo detector IC
Infrared LED
Switch
SMD components
(Resistor, etc.)
Putting rigid FPC on molding to arrange components
Need to mount parts perpendicularly
Peripheral parts all in one package!
Contributes to device
miniaturization!
Sensor (Photo detector IC + Infrared LED)
SMD components
Connector
Switch
Photo detector IC
Infrared LED
Switch
SMD components

Curved
surface
Aluminum refleciton
plate can be machined
or pressed
Reflective surface
can be formed in
the pattern!

Retain
Tab
Covers, shields, etc.,
fixed with bond or
solder
Tab structure
eliminates
bonding!
Adhesive bond
Tab

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What is MID?

Molded components with an electrical circuit directly formed on 3D surfaces.

MID

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MIPTEC Features

Panasonic Proprietary Technology*

*According to our research as of January, 2017

Panasonic Proprietary Technology Panasonic Proprietary Technology Panasonic Proprietary Technology


Comparison of MID processes

Possibilities are wide ranging with our proprietary “MIPTEC” processes.

Process name

Circuit forming process and characteristics

Panasonic
supported

Molds one set

Circuit pattern can be changed by simply changing the CAD data.

Fine patterns are possible by selectively removing only metalized part.(L/S=Min.50/50µm*)

Molds two sets

Die correction/re-construction is required for the secondary molding in order to change the circuit pattern.

Pattern width is limited by the working surface of the die. (L/S = 150/150µm)

Molds one set

Circuit pattern can be changed by simply changing the CAD data.

Fine patterns limited, because conductive particles in molded component are exposed. (L/S = 100/150µm)

*The values shown above are minimum values. Depending on the form, there may be some constraints. Please contact us for more information.

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APPLICATIONS

[Added value to parts with circuit pattern using proprietary technology]

Smaller, thinner, and more detailed
  • Miniaturization by component internalization
  • Miniature shapes are possible using fine patterns (from Min. 50 m) that were not possible using previous construction methods.


Camera modules for smartphone

Camera modules for medical endoscopes


Improves reflectance and mounting
  • Integration of component mounted circuits with structures (reflectors and snap fit structures, etc.).
  • Wire-bonding mounting


Inductive proximity sensor
for smartphone


[In various fields, contributes towards further miniaturization of
parts, feature advancement, and improved efficiency]

Appliance
for Various Sensor
Appliance
Medical
Medical
Mobile
for Proximity Sensor
Mobile
for Camera Module
Mobile
Measurement
 

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Catalog Download

CATALOG Title Language File size Update
MIPTEC
パナソニックのMID応用技術
JP 3.8MB January 30, 2017
MIPTEC
Panasonic MID Technology
EN 4.5MB February 15, 2017
MIPTEC
松下MID应用技术 MIPTEC
CN-Simplified 4.8MB April 19, 2017

If you have any questions about our products, feel free to email or call us!

CONTACT US

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