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R35(0.35mm pitch)

Supports 5 A for power terminal The ultra-small ( width 1.7mm ) high mating force connector

Socket

Header

: Please refer to "Cautions For Use" in the catalog.

Features

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Supports 5 A power terminals
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Slim: width 1.7 mm
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Low profile construction: mated height 0.6 mm
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Robust construction with metal exposure of flange section

Applications

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Wearable devices, smartphones, hearable devices and other small mobile devices

Lineup
- A35P(0.35mm pitch) Space savings and design flexibility are available by supporting high current rating
- A35UH(0.35mm pitch) Supports 5 A for power terminal. Reduce number of pins is available.
- B01 Achieved high current capacity ( 6 A ) and high reliability with low profile of 0.6 mm/0.8 mm
- B02 Low 0.7 mm profile, high current capacity ( 10 A ) , 4 signal pins
- P4SP(0.4mm pitch) Realized space savings for power line, and increased design flexibility
- R35(0.35mm pitch) Supports 5 A for power terminal The ultra-small ( width 1.7mm ) high mating force connector
CAD data　 Catalogs/Datasheets　　
FAQ

Part Number

Rating/Performance

Dimensions

Characteristics

Item			Specifications	Conditions
Electrical characteristics	Rated current	Power terminal	Max. 5.0 A/pin contact (2 terminal)	Cu thickness: 35 μm Pattern size: 10 mm (width)
	Rated current	Signal terminal	Max. 0.3 A/pin contact (All pins can carry; Max. 2 A)	Cu thickness: 35 μm Pattern size: 10 mm (width)
	Rated voltage		30 V AC, DC
	Dielectric strength		150 V AC for 1 min.	Detection current: 1 mA
	Insulation resistance		Min. 1,000 MΩ (Initial stage)	Using 250 V DC megger (1 min)
	Contact resistance	Power terminal	Max. 30 mΩ	Based on the contact resistance measurement method specified by JIS C 5402 (Current: Power terminal; 1 A, Signal terminal; 1 mA)
	Contact resistance	Signal terminal	Max. 90 mΩ
Mechanical characteristics	Composite insertion force	20 or less contacts	Max. 26.0 N (Initial stage)
	Composite insertion force	Over 20 contacts	Max. 1.300 N/pin contact x pin contacts (Initial stage)
	Composite removal force		Min. 0.165 N/pin contact x pin contacts
Environmental characteristics	Ambient temperature		-55 to +85°C	Include the calorification from the connector. No icing or condensation.
	Soldering heat resistance		The initial specification must be satisfied electrically and mechanically.	Max. peak temperature of 260 ℃ Infrared reflow soldering (PC board surface temperature near connector terminals) Soldering iron 300 °C within 5 sec 350 °C within 3 sec
	Storage temperature		-55 to +85°C (product only) -40 to +50°C (Packaging structure)	No icing or condensation.
	Thermal shock resistance (header and socket mated)		After 5 cycles, Insulation resistance: Min. 100 MΩ, Contact resistance: Max. 30 mΩ (Power terminal) Max. 90 mΩ (Signal terminal)	Conformed to MIL-STD-202F, method 107G
	Humidity resistance (header and socket mated)		After 120 hours, Insulation resistance: Min. 100 MΩ, Contact resistance: Max. 30 mΩ (Power terminal) Max. 90 mΩ (Signal terminal)	Conformed to IEC60068-2-78 Temperature 40±2°C Humidity 90 to 95% RH
	Saltwater spray resistance (header and socket mated)		After 24 hours, Insulation resistance: Min. 100 MΩ, Contact resistance: Max. 30 mΩ (Power terminal) Max. 90 mΩ (Signal terminal)	Conformed to IEC60068-2-11 Temperature 35±2°C Saltwater concentration 5±1%
	H₂S resistance (header and socket mated)		After 48 hours, Contact resistance: Max. 30 mΩ (Power terminal) Max. 90 mΩ (Signal terminal)	Temperature 40±2°C, Gas concentration 3±1 ppm, Humidity 75 to 80% RH
Lifetime characteristics	Insertion and removal life		Mechanical life: 30 times Contact resistance: Max. 30 mΩ (Power terminal) Max. 90 mΩ (Signal terminal) Composite removal force: Min. 0.165 N/pin contact x pin contacts	Repeated insertion and removal cycles of Max. 200 times/hour
Unit weight			10 pins Socket: 0.008 g Header: 0.003 g 30 pins Socket: 0.013 g Header: 0.006 g 60 pins Socket: 0.021 g Header: 0.010 g

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Material and surface treatment

Part name	Material	Surface treatment
Molded portion	Heat resistant plastic (UL94V-0)	−
Power terminal (Socket / Header)	Copper alloy	Contact portion: Au plating over nickel Terminal portion: Au plating over nickel (except for top of the terminal)
Signal terminal (Socket / Header)	Copper alloy	Contact portion: Au plating (Min. 0.05 μm) over nickel Terminal portion: Au plating over nickel (except for top of the terminal)