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Business > Industrial Devices > Automation Controls Top > Components & Devices > Connectors > High Current Connectors > P4SP(0.4mm pitch) > Rating/Performance
Realized space savings for power line, and increased design flexibility
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Item | Specifications | Conditions | ||
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Electrical characteristics |
Rated current |
Power contact | - | |
Signal contact | As power contact: 1.0 A/pin contact × 10 pins As signal contact: 0.5 A/pin contact (Max. 12 A at total pin contacts) |
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Rated voltage | 30 V AC/DC | |||
Dielectric strength | 150 V AC for 1 min | No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. | ||
Insulation resistance | Min. 1,000 MΩ (initial) | Using 250 V DC megger (applied for 1 min) | ||
Contact resistance | Max. 40 mΩ | Based on the contact resistance measurement method specified by JIS C 5402. | ||
Mechanical characteristics |
Composite insertion force | Max. 0.981 N/pin contact × pin contacts (initial) | ||
Composite removal force | Min. 0.0588 N/pin contact × pin contacts | |||
Environmental characteristics |
Ambient temperature | –55 to +85°C | Include the calorification from the connector. No icing. No condensation. | |
Soldering heat resistance | The initial specification must be satisfied electrically and mechanically. | Reflow soldering: Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) Soldering iron: 300°C within 5 sec. 350°C within 3 sec. |
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Storage temperature | –55 to +85°C (product only) –40 to +50°C (emboss packing) |
No icing. No condensation. | ||
Thermal shock resistance (header and socket mated) |
5 cycles, insulation resistance Min. 100 MΩ, contact resistance Max. 40 mΩ |
Conformed to MIL-STD-202F, method 107G |
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Humidity resistance (header and socket mated) |
120 hours, insulation resistance Min. 100 MΩ, contact resistance Max. 40 mΩ |
Conformed to IEC60068-2-78 Temperature 40±2°C, humidity 90 to 95% R.H. |
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Saltwater spray resistance (header and socket mated) |
24 hours, insulation resistance Min. 100 MΩ, contact resistance Max. 40 mΩ |
Conformed to IEC60068-2-11 Temperature 35±2°C, saltwater concentration 5±1% |
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H2S resistance (header and socket mated) |
48 hours, contact resistance Max. 40 mΩ |
Temperature 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. |
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Lifetime characteristics |
Insertion and removal life | 50 times | Repeated insertion and removal speed of Max. 200 times/hour | |
Unit weight | 20 pins Socket: 0.04 g 20 pins Header: 0.02 g |
Part name | Material | Surface treatment |
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Molded portion | LCP resin (UL94V-0) | − |
Contact and Post | Copper alloy | Contact portion:
Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). |
Soldering terminals | Copper alloy | Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating (except the terminal tips) |
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