AUTOMATION
CONTROLS

Search
Discontinued
Products



P4(0.4mm pitch)

Mated heights of 1.5 to 3.5 mm supported with “TOUGH CONTACT” construction to withstand of tough environments.

Features

  • Mated heights of 1.5 to 3.5 mm is available.

  • “TOUGH CONTACT” construction provides high resistance to various environment.

  • Pattern wiring is possible on PC board of the connector undersurface.

Applications

  • Mobile devices and industrial equipment

 

Characteristics

Item Specifications Conditions
Electrical
characteristics
Rated current 0.3 A/pin contact (Max. 5 A at total pin contacts)  
Rated voltage 60 V AC/DC  
Dielectric strength 150 V AC for 1 min. Rated voltage is applied for one minute and check for short circuit or damage with a detection current of 1 mA.
Insulation resistance Min. 1,000 MΩ (initial) Using 250 V DC megger (applied for 1 min.)
Contact resistance Max. 70 mΩ Based on the contact resistance measurement method specified by JIS C 5402.
Mechanical
characteristics
Composite insertion force [For mated height 1.5 mm]
Max. 0.981 N/pin contact x pin contacts
[For mated height 2.0 to 3.5 mm]
24 contacts or less: Max. 29.43 N
30 contacts or more: Max. 0.981 N/pin contact x pin contacts
 
Composite removal force [For mated height 1.5 mm]
Min. 0.0588 N/pin contact x pin contacts
[For mated height 2.0 to 3.5 mm]
Min. 0.118 N/pin contact x pin contacts
 
Environmental
characteristics
Ambient temperature -55 to +85°C No icing. No condensation.
Soldering heat resistance The initial specification must be satisfied electrically and mechanically. Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
Storage temperature -55 to +85°C (product only)
-40 to +50°C (emboss packing)
No icing. No condensation.
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance Min. 100 MΩ,
contact resistance Max. 70 mΩ
Humidity resistance
(header and socket mated)
120 hours,
insulation resistance Min. 100 MΩ,
contact resistance Max. 70 mΩ
Conformed to IEC60068-2-78
Temperature 40±2°C,
humidity 90 to 95% RH
Saltwater spray resistance
(header and socket mated)
24 hours,
insulation resistance Min. 100 MΩ,
contact resistance Max. 70 mΩ
Conformed to IEC60068-2-11
Temperature 35±2°C,
saltwater concentration 5±1%
H2S resistance
(header and socket mated)
48 hours,
contact resistance Max. 70 mΩ
Temperature 40±2°C,
gas concentration 3±1 ppm,
humidity 75 to 80% RH
Lifetime
characteristics
Insertion and removal life 50 times Repeated insertion and removal speed of Max. 200 times/hour
Unit weight Mated height 1.5 mm
20 pins Socket: 0.04 g Header: 0.02 g
 

Return to top

Material and surface treatment

Part name Material Surface treatment
Molded portion LCP resin (UL94V-0)
Contact and Post Copper alloy Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The terminals of Ni barrier production socket close to the portion to be soldered have nickel barriers (exposed nickel portions).

Return to top

Related Information

CONTACT US
If you have any questions, please select the option below to contact us or find answers.
CONTACT BY EMAIL / PHONE FIND LOCAL OFFICE SEARCH FAQ

Return to top

CONTACT US
BY EMAIL
Please click your area to select country or region



BY PHONE

FAQ


Requests to customers (Automation Control Components & Industrial Device) [Excluding specific product]
Requests to customers (Automation Control Components & Industrial Device) [For specific product]
Requests to customers (FA Sensors & Components [Excluding motors])
Requests to customers (Dedicated to industrial motors)