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Discontinued
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P4S(0.4mm pitch)

Features

  • “TOUGH CONTACT” construction for excellent vibration resistance

  • Pattern wiring possible on PC board of the connector undersurface

  • Compliant with all high-speed transfer standards

  • Models that support an ambient temperature of 125°C are also available.
    (For more information, please contact our sales office.)

  • Connectors for inspection available

  • Shield type is also available.

Applications

  • Mobile devices and industrial equipment

 

Characteristics

Item Specifications Conditions
Electrical
characteristics
Rated current 0.3A/pin contact (Max. 5 A at total pin contacts)  
Rated voltage 60V AC/DC  
Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute.
Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.)
Contact resistance Max. 90mΩ Based on the contact resistance measurement method specified by JIS C 5402.
Mechanical
characteristics
Composite insertion force Max. 0.981N/pin contact × pin contacts (initial)  
Composite removal force Min. 0.0588N/pin contact × pin contacts  
Environmental
characteristics
Ambient temperature –55 to +85°C*1 No icing. No condensation.
Soldering heat resistance The initial specification must be satisfied electrically and mechanically. Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
Storage temperature –55 to +85°C (product only)
–40 to +50°C (emboss packing)
No icing. No condensation.
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(header and socket mated)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Conformed to IEC60068-2-78
Temperature 40±2°C, humidity 90 to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Conformed to IEC60068-2-11
Temperature 35±2°C, saltwater concentration 5±1%
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 90mΩ
Temperature 40±2°C,
gas concentration 3±1 ppm, humidity 75 to 80% R.H.
Lifetime
characteristics
Insertion and removal life 50 times Repeated insertion and removal speed of max. 200 times/hours
Unit weight Mated height 1.5mm
20 pins Socket: 0.04 g Header: 0.02 g
 

*1. Please contact our sales office for use in ambient temperature of 125°C.

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Material and surface treatment

Part name Material Surface treatment
Molded portion LCP resin (UL94V-0)
Contact and Post Copper alloy Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals Copper alloy Sockets:
 Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips)
Headers:
 Base: Ni plating, Surface: Au plating (except the terminal tips)

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