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Discontinued
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P4S Shield type(0.4mm pitch)

Features

  • Radiation noise is reduced thanks to better grounding with multi-point ground construction and covering using a shield plate

  • “TOUGH CONTACT” construction provides high resistance to various environmental.

  • Previous standard product (P4S) can also be used on the header side.

  • Freedom of design is increased, because it has the same foot pattern as the previous standard product (P4S).

Applications

  • Note PCs and other mobile devices

 

Characteristics

Item Specifications Conditions
Electrical
characteristics
Rated current 0.3 A/pin contact (Max. 5 A at total pin contacts)
Rated voltage 60V AC/DC
Dielectric strength 150V AC for 1 minute Rated voltage is applied for one minute and check for short circuit or damage with a detection current of 1mA.
Insulation resistance Min. 1,000MΩ (Initial stage) Using 250V DC megger (applied for 1 minute)
Contact resistance Max. 90mΩ According to the contact resistance measurement method of JIS C 5402.
Mechanical
characteristics
Composite insertion force Max. 0.981N/pin contact × pin contacts (Initial stage)  
Composite removal force Min. 0.0588N/pin contact × pin contacts  
Environmental
characteristics
Ambient temperature –55 to +85°C No icing. No condensation.
Soldering heat resistance The initial specification must be satisfied electrically and mechanically. Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
Storage temperature –55 to +85°C (Products only)
–40 to +50°C (emboss packing)
No icing. No condensation.
Thermal shock resistance
(Header and socket mated)
5 cycles
insulation resistance: Min. 100MΩ,
contact resistance: Max. 90mΩ
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(Header and socket mated)
120 hours
insulation resistance: Min. 100MΩ,
contact resistance: Max. 90mΩ
Conformed to IEC60068-2-78
Temperature 40±2°C, humidity 90 to 95% R.H.
Salt water spray resistance
(Header and socket mated)
24 hours
insulation resistance: Min. 100MΩ,
contact resistance: Max. 90mΩ
Conformed to IEC60068-2-11
Temperature 35±2°C, salt water concentration 5±1%
H2S resistance
(Header and socket mated)
48 hours
contact resistance: Max. 90mΩ
Temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics
Insertion and removal life 50 times Repeated insertion and removal speed of max. 200 times/hours
Unit weight 38 pins: Socket 0.07g, Header 0.03g
50 pins: Socket 0.09g, Header 0.04g
74 pins: Socket 0.12g, Header 0.05g

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Material and surface treatment

Part name Material Surface treatment
Molded portion LCP resin (UL94V-0)
Contact and Post Copper alloy Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Shield plate Copper alloy Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating
Soldering terminals Copper alloy Sockets:
 Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips)
Headers:
 Base: Ni plating, Surface: Au plating (except the terminal tips)

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