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Discontinued
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P5KF(0.5mm pitch)

0.5 mm pitch and 1.5 to 2.5 mm mated height available

Features

  • Wide lineup for pin counts

  • “TOUGH CONTACT” construction provides high resistance to various environmental.

  • Simple lock mechanism provides tactile feedback to ensure excellent mating/unmating operation feel.

  • Effective mating length 0.55 mm

Applications

  • Mobile devices and industrial equipment

 

Characteristics

Item Specifications Conditions
Electrical
characteristics
Rated current 0.5 A/pin contact (Max. 10 A at total pin contacts)  
Rated voltage 60 V AC/DC  
Dielectric strength 150 V AC for 1 min No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute.
Insulation resistance Min. 1,000 MΩ (initial) Using 500 V DC megger (applied for 1 min)
Contact resistance Max. 90 mΩ Based on the contact resistance measurement method specified by JIS C 5402.
Mechanical
characteristics
Composite insertion force Max. 0.981 N/pin contacts x pin contacts (initial)  
Composite removal force Min. 0.0588 N/pin contacts x pin contacts  
Environmental
characteristics
Ambient temperature –55 to +85°C No icing. No condensation.
Soldering heat resistance The initial specification must be satisfied electrically and mechanically. Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
Storage temperature –55 to +85°C (product only)
–40 to +50°C (emboss packing)
No icing. No condensation.
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance Min. 100 MΩ,
contact resistance Max. 90 mΩ
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(header and socket mated)
120 hours,
insulation resistance Min. 100 MΩ,
contact resistance Max. 90 mΩ
Conformed to IEC60068-2-78
Temperature 40±2°C, humidity 90 to 95% RH
Saltwater spray resistance
(header and socket mated)
24 hours,
insulation resistance Min. 100 MΩ,
contact resistance Max. 90 mΩ
Conformed to IEC60068-2-11
Temperature 35±2°C, saltwater concentration 5±1%
H2S resistance
(header and socket mated)
48 hours,
contact resistance Max. 90 mΩ
Temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% RH
Lifetime
characteristics
Insertion and removal life 50 times Repeated insertion and removal speed of Max. 200 times/hour
Unit weight Mated height 1.5 mm
20 pins Socket: 0.06 g, Header: 0.04 g
 

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Material and surface treatment

Part name Material Surface treatment
Molded portion LCP resin (UL94V-0)
Contact and Post Copper alloy Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion:
 Base: Ni plating, Surface: Au plating (except the terminal tips)
 The terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).

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Related Information

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