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R35K (0.35 mm pitch)

The ultra-small ( width 1.3 mm ) , robust yet high mating force connector that can energize 3 A.

Socket

Header

: Please refer to "Cautions For Use" in the catalog.

Features

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Slim: width 1.3 mm
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Low profile construction: mated height 0.6 mm
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“TOUGH CONTACT” construction withstands tough environments despite being slim and low profile.
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Double contact with a simple lock structure made this connector realize low profile, make a good clicking feel and high removal force.

Applications

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Wearable devices, hearable devices
(Battery, Side Switches, various sensor module connection)

Lineup
- A35S(0.35mm pitch) Contributes to device miniaturization and advanced functionality with 2.5 mm width, 0.35 mm pitch and 0.8 mm mated height!
- A4S(0.4mm pitch) Being 2.5 mm in width, it facilitates ever-increasing device miniaturization and advanced functionality!
- F4S(0.4mm pitch) Space-saving design with mated height of 1.0 mm and 3.6 mm width
- P4(0.4mm pitch) Mated heights of 1.5 to 3.5 mm supported with " TOUGH CONTACT " construction to withstand of tough environments.
- P4S(0.4mm pitch) High reliability, space saving type, 1.5 to 3.0 mm mated height
- P4S Shield type(0.4mm pitch) Radiation noise reduced by multi-point ground and shield construction
- P5K/P5KS(0.5mm pitch) Mated heights of 3.0 to 9.0 mm supported with " TOUGH CONTACT " construction provides resistant to various environmental conditions.
- P5KF(0.5mm pitch) 0.5 mm pitch and 1.5 to 2.5 mm mated height available
- R35K(0.35mm pitch) The ultra-small ( width 1.3 mm ) , robust yet high mating force connector that can energize 3 A.
- S35(0.35mm pitch) Excellent contact reliability and mating in a super miniature size ( width 1.7 mm )
CAD data　 Catalogs/Datasheets　　
FAQ

Part Number

Rating/Performance

Dimensions

Characteristics

Item		Specifications	Conditions
Electrical characteristics	Rated current	3.0 A / pin contact (Power terminal) 0.3 A / pin contact (Signal terminal)
	Rated voltage	30 V AC / DC
	Dielectric strength	150 V AC for 1 min	No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for 1 min
	Insulation resistance	Min. 1,000 MΩ (Initial)	Using 250 V DC megger (applied for 1 min)
	Contact resistance	Max. 30 mΩ (Power terminal) Max. 90 mΩ (Signal terminal)	Based on the contact resistance measurement method specified by JIS C 5402.
Mechanical characteristics	Composite insertion force	Max. 25 N (Initial)
Mechanical characteristics	Composite removal force	Min. 3.0 N (Initial)
Environmental characteristics	Ambient temperature	–55 to + 85°C	No icing. No condensation.
	Soldering heat resistance	The initial specification must be satisfied electrically and mechanically.	Reflow soldering: Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
	Storage temperature	–55 to +85°C (Products only) –40 to +50°C (Emboss packing)	No icing. No condensation.
	Thermal shock resistance (header and socket mated)	5 cycles, insulation resistance: Min. 100 MΩ, contact resistance: Max. 30 mΩ (Power terminal) contact resistance: Max. 90 mΩ (Signal terminal)
	Humidity resistance (header and socket mated)	120 hours, insulation resistance: Min. 100 MΩ, contact resistance: Max. 30 mΩ (Power terminal) contact resistance: Max. 90 mΩ (Signal terminal)	Conformed to IEC 60068-2-78 Temperature 40 ± 2°C, Humidity 90 to 95% RH
	Saltwater spray resistance (header and socket mated)	24 hours, insulation resistance: Min. 100 MΩ, contact resistance: Max. 30 mΩ (Power terminal) contact resistance: Max. 90 mΩ (Signal terminal)	Conformed to IEC 60068-2-11 Temperature 35 ± 2°C, Salt water concentration 5 ± 1%
	H₂S resistance (header and socket mated)	48 hours, contact resistance: Max. 30 mΩ (Power terminal) contact resistance: Max. 90 mΩ (Signal terminal)	Temperature 40 ± 2°C, Gas concentration 3 ± 1 ppm, Humidity 75 to 80% RH
Lifetime characteristics	Insertion and removal life	10 times	Repeated insertion and removal cycles of Max. 200 times/hour
Unit weight		4 pins Socket: 0.004 g, Header: 0.001 g 6 pins Socket: 0.005 g, Header: 0.002 g

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Material and surface treatment

Part name	Material	Surface treatment
Molded portion	LCP resin (UL94V-0)	−
Contact and Post	Copper alloy	Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals	Copper alloy	Sockets:Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips)