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S35(0.35mm pitch)

Excellent contact reliability and mating in a super miniature size ( width 1.7 mm )

Socket

Header

: Please refer to "Cautions For Use" in the catalog.

Features

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Slim: width 1.7mm
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Low profile construction: mated height 0.6 mm/0.8 mm
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“TOUGH CONTACT” construction withstands tough environments despite being slim and low profile.
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For 0.6mm mated height, thanks to our proprietary “Fine fitting” construction, high removability with a nice click feel is maintained while being low profile.

Applications

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Wearable devices, smartphones and hearable devices

Lineup
- A35S(0.35mm pitch) Contributes to device miniaturization and advanced functionality with 2.5 mm width, 0.35 mm pitch and 0.8 mm mated height!
- A4S(0.4mm pitch) Being 2.5 mm in width, it facilitates ever-increasing device miniaturization and advanced functionality!
- F4S(0.4mm pitch) Space-saving design with mated height of 1.0 mm and 3.6 mm width
- P4(0.4mm pitch) Mated heights of 1.5 to 3.5 mm supported with " TOUGH CONTACT " construction to withstand of tough environments.
- P4S(0.4mm pitch) High reliability, space saving type, 1.5 to 3.0 mm mated height
- P4S Shield type(0.4mm pitch) Radiation noise reduced by multi-point ground and shield construction
- P5K/P5KS(0.5mm pitch) Mated heights of 3.0 to 9.0 mm supported with " TOUGH CONTACT " construction provides resistant to various environmental conditions.
- P5KF(0.5mm pitch) 0.5 mm pitch and 1.5 to 2.5 mm mated height available
- R35K(0.35mm pitch) The ultra-small ( width 1.3 mm ) , robust yet high mating force connector that can energize 3 A.
- S35(0.35mm pitch) Excellent contact reliability and mating in a super miniature size ( width 1.7 mm )
CAD data　 Catalogs/Datasheets　　
FAQ

Part Number

Rating/Performance

Dimensions

Characteristics

Item		Specifications	Conditions
Electrical characteristics	Rated current	Max. 0.3 A/pin contact (Max. 5 A at total pin contacts)
	Rated voltage	60 V AC/DC
	Dielectric strength	150 V AC for 1 min	No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for 1 min
	Insulation resistance	Min. 1,000 MΩ (Initial)	Using 250 V DC megger (applied for 1 min)
	Contact resistance	Max. 90 mΩ	According to the contact resistance measurement method of JIS C 5402
Mechanical characteristics	Composite insertion force	h = 0.6 mm 20 or less pins: Max. 26.0 N, pin contact Over 22 pins: Max. 1.300 N/pin contact x pin contacts (Initial) h = 0.8 mm Max. 1.300 N/pin contact x pin contacts (Initial)
Mechanical characteristics	Composite removal force	Min. 0.215 N/pin contact x pin contacts
Environmental characteristics	Ambient temperature	-55 to +85°C	No icing. No condensation.
	Soldering heat resistance	The initial specification must be satisfied electrically and mechanically.	Reflow soldering: Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
	Storage temperature	-55 to +85°C (Products only) -40 to +50°C (Packaging structure)	No icing. No condensation.
	Thermal shock resistance (Header and socket mated)	5 cycles, insulation resistance: Min. 100 MΩ, contact resistance: Max. 90 mΩ	Conformed to MIL-STD-202F, method 107G
	Humidity resistance (Header and socket mated)	120 hours, insulation resistance: Min. 100 MΩ, contact resistance: Max. 90 mΩ	Conformed to IEC60068-2-78 Temperature 40±2°C, Humidity 90 to 95% RH
	Salt water spray resistance (Header and socket mated)	24 hours, insulation resistance: Min. 100 MΩ, contact resistance: Max. 90mΩ	Conformed to IEC60068-2-11 Temperature 35±2°C, Salt water concentration 5±1%
	H₂S resistance (Header and socket mated)	48 hours, contact resistance: Max. 90 mΩ	Temperature 40±2°C, Gas concentration 3±1 ppm, Humidity 75 to 80% RH
Lifetime characteristics	Insertion and removal life	30 times	Repeated insertion and removal cycles of max. 200 times/hour
Unit weight		34 pins Socket h = 0.6 mm: 0.01 g, h = 0.8 mm: 0.02 g 34 pins Header h = 0.6 mm: 0.01 g, h = 0.8 mm: 0.01 g

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Material and surface treatment

Part name	Material	Surface treatment
Molded portion	LCP resin (UL94V-0)	—
Contact and Post	Copper alloy	Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals	Copper alloy	Sockets: 　Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips) Headers: 　Base: Ni plating, Surface: Au plating (except the terminal tips)