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Discontinued
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A35UH(0.35mm pitch)

Features

  • Supports 5 A for power terminals

  • With power terminal, so number of pins can be reduced

  • “TOUGH CONTACT” construction provides high resistance to various environmental.

Applications

  • Smartphones, tablet PCs and other mobile devices

 

Characteristics

Item Specifications Conditions
Electrical
characteristics
Rated
current
Power contact 5.0A/pin contact  
Signal contact 0.3A/pin contact (Max. 5 A at total pin contacts)  
Rated voltage 30V AC/DC  
Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute.
Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.)
Contact resistance Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal)
Based on the contact resistance measurement method specified by JIS C 5402.
Mechanical
characteristics
Composite insertion force 1.300N/pin contact × pin contacts  
Composite removal force 0.165N/pin contact × pin contacts  
Environmental
characteristics
Ambient temperature –55 to +85°C No icing. No condensation.
Soldering heat resistance The initial specification must be satisfied electrically and mechanically Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector terminals)
Soldering iron: 300°C within 5 sec., 350°C within 3 sec.
Storage temperature –55 to +85°C (product only)
–40 to +50°C (emboss packing)
No icing. No condensation.
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ (power terminal)
max. 90mΩ (signal terminal)
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(header and socket mated)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ (power terminal)
max. 90mΩ (signal terminal)
Conformed to IEC60068-2-78
Temperature 40±2°C, humidity 90 to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ (power terminal)
max. 90mΩ (signal terminal)
Conformed to IEC60068-2-11
Temperature 35±2°C, saltwater concentration 5±1%
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 30mΩ (power terminal)
max. 90mΩ (signal terminal)
Temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics
Insertion and removal life 30 times Repeated insertion and removal speed of max. 200 times/hours
Unit weight 60 pins Socket: 0.02g Header: 0.01g  

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Material and surface treatment

Part name Material Surface treatment
Molded portion LCP resin (UL94V-0)
Contact and Post
Power terminal
Copper alloy Contact portion: Base: Ni plating Surface: Au plating
Terminal portion:
 Base: Ni plating Surface: Au plating (except the terminal tips)
 The terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).

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