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Discontinued
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B01

Features

  • High current rating: 6 A (3 A/pin × 4 pins)

  • High removal force while miniature and low profile

Applications

  • Smartphones, tablet PCs and other mobile devices

 

Characteristics

Item Specifications Conditions
Electrical
characteristics
Rated
current
Power contact 3.0A/pin contact  
Signal contact 0.3A/pin contact  
Rated voltage 30V AC/DC  
Dielectric strength 150V AC for 1 minute No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute.
Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 minute)
Contact resistance Max. 20mΩ (power terminal)
Max. 90mΩ (signal terminal)
According to the contact resistance measurement method of JIS C 5402
Mechanical
characteristics
Composite insertion force Max. 40 N  
Composite removal force Min. 10 N (H: 0.6, initial)  
Environmental
characteristics
Ambient temperature –55 to +85°C No icing. No condensation.
Soldering heat resistance The initial specification must be satisfied electrically and mechanically Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
Storage temperature –55 to +85°C (products only)
–40 to +50°C (emboss packing)
No icing. No condensation.
Thermal shock resistance
(Header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 20mΩ (power terminal)
max. 90mΩ (signal terminal)
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(Header and socket mated)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 20mΩ (power terminal)
max. 90mΩ (signal terminal)
Conformed to IEC60068-2-78
Temperature 40±2°C, humidity 90 to 95% R.H.
Salt water spray resistance
(Header and socket mated)
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 20mΩ (power terminal)
max. 90mΩ (signal terminal)
Conformed to IEC60068-2-11
Temperature 35±2°C, salt water concentration 5±1%
H2S resistance
(Header and socket mated)
48 hours,
contact resistance max. 20mΩ (power terminal)
max. 90mΩ (signal terminal)
Conformed to JEIDA-38-1984
Temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics
Insertion and removal life Mechanical life 30 times
Contact resistance max. 20mΩ (power terminal)
max. 90mΩ (signal terminal)
Composite removal force min. 7 N
Repeated insertion and removal cycles of max. 200 times/hour
Unit weight 6 pins Socket
 h = 0.6 mm: 0.010g, h = 0.8 mm: 0.013g
6 pins Header
 h = 0.6 mm: 0.004g, h = 0.8 mm: 0.005g
 

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Material and surface treatment

Part name Material Surface treatment
Molded portion LCP resin (UL94V-0)
Contact and Post Copper alloy Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals Copper alloy Sockets:
 Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips)
Headers:
 Base: Ni plating, Surface: Au plating (except the terminal tips)

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