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Business > Industrial Devices > Automation Controls Top > Components & Devices > Connectors > High Current Connectors > B01 > Rating/Performance
Achieved high current capacity ( 6 A ) and high reliability with low profile of 0.6 mm/0.8 mm
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Item | Specifications | Conditions | ||
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Electrical characteristics |
Rated current |
Power contact | 3.0 A/pin contact | |
Signal contact | 0.3 A/pin contact | |||
Rated voltage | 30 V AC/DC | |||
Dielectric strength | 150 V AC for 1 min | No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. | ||
Insulation resistance | Min. 1,000 MΩ (initial) | Using 250 V DC megger (applied for 1 min) | ||
Contact resistance | Max. 20 mΩ (power terminal) Max. 90 mΩ (signal terminal) |
Based on the contact resistance measurement method specified by JIS C 5402. | ||
Mechanical characteristics |
Composite insertion force | Max. 40 N | ||
Composite removal force | Min. 10 N (H: 0.6, initial) | |||
Environmental characteristics |
Ambient temperature | -55 to +85°C | Include the calorification from the connector. No icing. No condensation. | |
Soldering heat resistance | The initial specification must be satisfied electrically and mechanically | Reflow soldering: Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) Soldering iron: 300°C within 5 sec. 350°C within 3 sec. |
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Storage temperature | -55 to +85°C (products only) -40 to +50°C (emboss packing) |
No icing. No condensation. | ||
Thermal shock resistance (Header and socket mated) |
5 cycles, insulation resistance Min. 100 MΩ, contact resistance Max. 20 mΩ (power terminal) Max. 90 mΩ (signal terminal) |
Conformed to MIL-STD-202F, method 107G |
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Humidity resistance (Header and socket mated) |
120 hours, insulation resistance Min. 100 MΩ, contact resistance Max. 20 mΩ (power terminal) Max. 90 mΩ (signal terminal) |
Conformed to IEC60068-2-78 Temperature 40±2°C humidity 90 to 95% RH |
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Saltwater spray resistance (Header and socket mated) |
24 hours, insulation resistance Min. 100 MΩ, contact resistance Max. 20 mΩ (power terminal) Max. 90 mΩ (signal terminal) |
Conformed to IEC60068-2-11 Temperature 35±2°C saltwater concentration 5±1% |
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H2S resistance (Header and socket mated) |
48 hours, contact resistance Max. 20 mΩ (power terminal) Max. 90 mΩ (signal terminal) |
Conformed to JEIDA-38-1984 Temperature 40±2°C gas concentration 3±1 ppm, humidity 75 to 80% RH |
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Lifetime characteristics |
Insertion and removal life | Mechanical life 30 times Contact resistance Max. 20 mΩ (power terminal) Max. 90 mΩ (signal terminal) Composite removal force Min. 7 N |
Repeated insertion and removal speed of Max. 200 times/hour | |
Unit weight | 6 pins Socket h = 0.6 mm: 0.010 g, h = 0.8 mm: 0.013 g 6 pins Header h = 0.6 mm: 0.004 g, h = 0.8 mm: 0.005 g |
Part name | Material | Surface treatment |
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Molded portion | LCP resin (UL94V-0) |
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Contact and Post | Copper alloy | Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). |
Soldering terminals | Copper alloy | Sockets: Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips) |
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