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RF35(0.35mm pitch)

For 5 G Millimeter-wave Antenna Modules. 15 GHz with 5 G specifications.

: Please refer to "Cautions For Use" in the catalog.

Features

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Good SI / EMI / EMS characteristics with high frequency application
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Tough Contact structure achieves high contact reliability and high retention force
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With metal exposure structure, tough against shock impact by misalignment motion or dropping

Applications

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Connection between antenna module to main board 5G Millimeter-wave Antenna / UWB (Ultra Wide Band) Antenna, etc.
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Smart phone / Tablet / Laptop / Router

Lineup
- RF35(0.35mm pitch) For 5 G Millimeter-wave Antenna Modules. 15 GHz with 5 G specifications.
- RF4(0.35mm pitch) Compatible with 5G Millimeter-wave Antenna Modules. Excellent EMI/SI performance.
CAD data　 Catalogs/Datasheets　　
FAQ

Part Number

Rating/Performance

Dimensions

Characteristics

Item		Specifications	Conditions
Electrical characteristics	Rated current	Max. 0.3 A / pin contact x 8 pin contacts (signal contact)
	Rated current	Max. 1.0 A / pin contact x 2 pin contacts (power contact)
	Rated voltage	30 V AC, DC
	Dielectric strength	150 V AC for 1 min	Detection current: 1 mA
	Insulation resistance	Min. 1,000 MΩ (Initial stage)	Using 250 V DC megger (applied for 1 min)
	Contact resistance	Max. 90 mΩ	According to the method of JIS C 5402 (Current: 1 mA)
	Insertion loss	DC to 10 GHz: Max. 0.30 dB 10 to 15 GHz: Max. 0.50 dB
	Isolation	DC to 10 GHz: Min. 45 dB 10 to 15 GHz: Min. 35 dB
	V. S. W. R	DC to 3 GHz: Max. 1.2 3 to 6 GHz: Max. 1.4 6 to 12 GHz: Max. 1.5 12 to 15 GHz: Max. 2.0
	Characteristic impedance	50±5 Ω
Mechanical characteristics	Composite insertion force	Max. 40 N (Initial stage)
Mechanical characteristics	Composite removal force	Min. 2.0 N (Initial stage)
Environmental characteristics	Ambient temperature	-50 to +85°C	No icing or condensation
	Ambient temperature Soldering heat resistance	The initial specificaton must be satisfied electrically and mechanically	Max. peak temperature of 260 °C Infrared reflow soldering (PC board surface temperature near connector terminals)
	Storage temperature	-55 to +85°C (Products only) -40 to +50°C (Packaging structure)	No icing or condensation
	Thermal shock resistance (header and socket mated)	After 5 cycles, Insulation resistance: Min. 100 MΩ, Contact resistance: Max. 90 mΩ
	Humidity resistance (header and socket mated)	After 120 hours, Insulation resistance: Min.100 MΩ, Contact resistance: Max. 90 mΩ	IEC60068-2-78 Temperature: 40±2°C Humidity: 90 to 95% RH
	Saltwater spray resistance (header and socket mated)	After 24 hours, Insulation resistance: Min. 100 MΩ, Contact resistance: Max. 90 mΩ	IEC60068-2-11 Temperature: 35±2°C saltwater concentration: 5±1%
	H₂S resistance (header and socket mated)	After 48 hours, Contact resistance: Max. 90 mΩ	Temperature: 40±2°C Gas concentration: 3±1 ppm Humidity: 75 to 80% RH
Lifetime characteristics	Insertion and removal life	Mechanical life: 10 times Contact resistance: Max. 90 mΩ Composite removal force: Min. 2.0 N	Repeated insertion and removal cycles of max. 200 times / hour
Unit weight		10 contacts Soket: 0.009 g Header: 0.005 g

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Material and surface treatment

Part name	Material	Surface treatment
Molded portion	LCP resin (UL94V-0)	-
Contact and Post	Copper alloy	Contact portion (main): Au plating, over nickel Contact portion (Sub): Au plating, over nickel Terminal portion: Au plating, over nickel (except for top of the terminal) Ground terminal: Au plating, over nickel (except for top of the terminal)