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2.6mm x 1.6mm SMD (EVPBB)

Lineup
- 2.6mm x 1.6mm SMD Low profile (0.5 to 0.53mm) and Small size (2.6 x 1.6mm). IP67
- 2.8mm x 1.9mm SMD Low profile (0.53mm to 0.60mm) and Small size (2.8 x 1.9mm). IP67
- 2.8mm x 2.3mm Side-operational Edge Mount Side operational type with small size and improved soldering strength in operationg direction.
- 3.0mm x 2.0mm SMD Low profile (0.6mm) and Small size (3.0 x 2.0mm). IP67
- 3.0mm x 2.6mm SMD Low profile (0.65mm) and Small size (3.0 x 2.6mm).
- 3.0mm x 2.6mm Double-action SMD Double action with small size.
- 3.4mm x 2.9mm SMD Low profile (0.7mm) and Small size (3.4 x 2.9mm). IP67
- 3.4mm x 1.7mm Side-operational Edge Mount Side operational type with small size and improved soldering strength in operationg direction. IP67
- 3.5mm x 2.9mm SMD High operating force. With a ground terminal type available.
- 3.5mm x 2.9mm Side-operational SMD External dimensions: 3.5 x 2.9mm. Wide variety of terminal shape. Enhanced push plate strength performance.
- 3.5mm x 2.9mm Side-operational Half Dive/SMD Side operational type with low profile. Half dive mount with 0.7mm height from PCB surface.
- 3.8mm x 1.9mm Side-operational SMD Side operational type (External dimensions: 3.9 x 2.05mm). IP67
- 4mm Square SMD External dimensions: 4.1 x 4.1mm. Wide product variety. (With/Without a push plate, and with a ground terminal type available.)
- 4.5mm x 2.2mm Side-operational Edge Mount Side operational type with small size and improved soldering strength in operationg direction. Electrostatic countermeasure performance.
- 4.7mm x 3.5mm SMD High operating force and Long operational life.
- 4.9mm x 4.0mm SMD Achieved Long operation travel 0.23mm with low profile package 0.63mm
- 4.9mm Square SMD External dimensions: 4.9 x 4.9mm. With/Without a push plate type available.
- 6.0mm x 3.5mm External dimensions: 6.0 x 3.5mm. Vertical operational type with snap-in terminals.
- 6.0mm x 3.5mm SMD Surface mount type (External dimensins: 6.0 x 3.5mm).
- 6mm Square Thin Type SMD External dimensions: 6.5 x 6.0mm. With over travel function available.
- 6mm Square Middle Travel SMD Middle travel feeling
- 6mm Square Middle Travel 2 terminals SMD Middle travel type with two terminal structure.
- 6mm Square Long Travel 2R Long travel type with radial tape.
- 6mm Square Long Travel 2 terminals SMD Long travel type with two terminal structure.
- 6mm Square Long Travel SMD External dimensions: 6.0 x 6.1mm. Long travel type.
- 6.2mm x 2.5mm Side-operational Edge Mount Side operational type with small size and improved soldering strength in operationg direction. High operating force performance.
- 8mm Square Long Travel SMD Prevent incorrect operation with high operating force.
- 10 mm Square Center Space Long Travel SMD Center space structure and surface mount type.
- Small-sized Side-operational SMD Side operational type (External dimensions: 4.7 x 3.5mm).
- Over Travel Comfortable for long hours of operation thanks to over travel function.
CAD data　 Catalogs/Datasheets　　
FAQ

Basic Information

Part Number

Rating/Performance

Dimensions

Unit : mm

1.DIMENSIONS
2.EMBOSSED TAPE DIMENSIONS

1.DIMENSIONS

EVPBB

(Embossed Taping)

External dimensions

General dimension tolerance: ±0.05
( ) dimensions are reference dimensions.

Part No.	Operating Force	H=Height	Operating Life
EVPBB0AAE000	0.7 N	0.5 mm	200,000 cycles
EVPBB1AAE000	1.0 N	0.5 mm	500,000 cycles
EVPBB2A9E000	1.6 N	0.53 mm	500,000 cycles
EVPBB4A9E000	2.4 N	0.55 mm	500,000 cycles

Circuit diagram

Stencil mask plan

PWB land pattern for reference

Soldering thickness t=0.08±0.01

*	Soldering failure may occur depending on applied solder amount, so, please consider to use our recommended stencil and land pattern design.

		: Recommended land pattern area
		: No soldering area

・	Any land pattern or via holes shall not be provided at area.
・	If it's necessary to design land pattern or via holes at area, please apply resist to them to protect their metal part completely.
・	If their metal parts are not protected completely, short circuit failure may occur by solder ball.
・	Besides, there should be convexoconcave by designing additional pattern, it may cause switch tilt, influence on solder-ability or flux intrusion after reflow soldering.
・	Therefore, please study any influence of additional land pattern or via holes at area in advance.