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Discontinued
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Y3BL(0.3mm pitch)

Y3BL(0.3mm pitch)
Y3BL(0.3mm pitch)
RoHS compliant
Please refer to "Cautions For Use" in the catalog.

Features

  • ●

    Low profile (0.6 mm) and slim design

  • ●

    Compatible with FPC 0.2 mm thickness

  • ●

    High durability assured with proprietary soldering terminals

  • ●

    Time and effort can be reduced by delivering with lever open.

  • ●

    Wiring patterns can be placed underneath the connector.

  • ●

    Ni barrier with high resistance to solder creepage

Applications

  • ●

    Smartphones, tablet PCs and other mobile devices

Rating/Performance
　

Characteristics

The followings show specifications, when using an applicable FPC (thickness 0.20 mm)

Item Specifications Conditions
Electrical
characteristics		 Rated current 0.2A/pin contact (Max. 5 A at total contacts)  
Rated voltage 50V AC/DC  
Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.)
Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute.
Contact resistance Max. 160mΩ Based on the contact resistance measurement method specified by JIS C 5402.
Mechanical
characteristics		 FPC holding force Min. 0.10N/pin contact × pin contacts (initial) Measurement of the maximum force applied until the inserted compatible FPC is pulled out in the insertion axis direction while the connector lever is closed
Environmental
characteristics		 Ambient temperature –55 to +85°C No icing. No condensation.
Soldering heat resistance The initial specification must be satisfied electrically and mechanically. Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
Storage temperature –55 to +85°C (product only)
–40 to +50°C (emboss packing)		 No icing. No condensation.
Thermal shock resistance
(with FPC mated)		 5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 160mΩ		 Conformed to MIL-STD-202F, method 107G
Humidity resistance
(with FPC mated)		 120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 160mΩ		 Conformed to IEC60068-2-78
Temperature 40±2°C, humidity 90 to 95% R.H.
Saltwater spray resistance
(with FPC mated)		 24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 160mΩ		 Conformed to IEC60068-2-11
Temperature 35±2°C, saltwater concentration 5±1%
H2S resistance
(with FPC mated)		 48 hours,
contact resistance max. 160mΩ		 Temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics		 Insertion and removal life 20 times Repeated insertion and removal: min. 10 sec./time
Unit weight 51 pins: 0.05 g  

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Material and surface treatment

Part name Material Surface treatment
Molded portion Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0) 		—
Contact Copper alloy Contact portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
Soldering terminal Copper alloy Ni on base, Pd + Au flash plating

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Rating/Performance
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