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Discontinued
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RF4(0.35mm pitch)

Compatible with 5G Millimeter-wave Antenna Modules. Excellent EMI/SI performance.

Socket
Header
Tough Contact
Please refer to "Cautions For Use" in the catalog.

Features

  • ●

    Seamless metal shield with all-around contact achieves both good EMI characteristics and high robustness

  • ●

    Good SI characteristics with terminals for high frequency signals and shielded terminals

  • ●

    TOUGH CONTACT structure and shield lock structure achieves high contact reliability and high retention force

Applications

  • ●

    Smartphone, Tablet, Laptop, Router etc.

    ・For 5G Millimeter-wave Antenna/
     UWB (Ultra Wide Band) Antenna
    ・Connection between antenna module to
     main board

Rating/Performance
　　

Characteristics

Item Specifications Conditions
Electrical
characteristics		 Rated current Max. 0.3 A / pin contact x 6 pin contacts
Max. 1.0 A / pin contact x 2 pin contacts
(2 pin contacts other than high frequency signal contacts)
Rated voltage 30 V AC, DC
Dielectric strength 150 V AC for 1 minute Detection current: 1 mA
Insulation resistance Min. 1000 MΩ (Initial stage) Using 250 V DC megger (1 minute)
Contact resistance Max. 90 mΩ According to the method of JIS C 5402
(Current: 1 mA)
Frequency DC to 15 GHz
V.S.W.R DC to 3 GHz: Max. 1.2
3 to 6 GHz: Max. 1.4
6 to 12 GHz: Max. 1.5
12 to 15 GHz: Max. 2.0
Insertion loss DC to 10 GHz: Max. 0.30 dB
10 to 15 GHz: Max. 0.50 dB
Isolation DC to 10 GHz: Min. 45 dB
10 to 15 GHz: Min. 35 dB
Mechanical
characteristics		 Composite insertion force Max. 50 N (Initial stage)
Composite removal force 5 to 40 N (Initial stage)
Environmental
characteristics		 Ambient temperature
(Operating temperature)		 -55 to +85°C No icing or condensation
Include the calorification from the connector
Storage temperature -55 to +85°C (Products only)
-40 to +50°C (Packaging structure)		 No icing or condensation
Soldering heat resistance The initial specification must be satisfied electrically and mechanically Max. peak temperature of 260°C Infrared reflow soldering
(PC board surface temperature near connector terminals )
Thermal shock resistance
(header and socket mated)		 After 5 cycles
Insulation resistance: Min. 100 MΩ
Contact resistance : Max. 90 mΩ
Humidity resistance
(header and socket mated)		 After 120 hours
Insulation resistance: Min. 100 MΩ
Contact resistance: Max. 90 mΩ		 IEC60068-2-78
Temperature: 40±2°C
Humidity: 90 to 95% RH
Salt water spray resistance
(header and socket mated)		 After 24 hours
Insulation resistance: Min. 100 MΩ
Contact resistance: Max. 90 mΩ		 IEC60068-2-11
Temperature: 35±2°C
Salt water concentration: 5±1%
H2S resistance
(header and socket mated)		 After 48 hours
Contact resistance: Max. 90 mΩ		 Temperature: 40±2°C
Gas concentration: 3±1 ppm
Humidity: 75 to 80% RH
Lifetime
characteristics		 Insertion and removal life Mechanical life: 10 times
Contact resistance: Max. 90 mΩ
Composite removal force: 5 to 40 N		 Repeated insertion and removal cycles of max. 200 times/hour
Unit weight 6 contacts
Soket: 0.010 g
Header: 0.006 g

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Material and surface treatment

Part name Material Surface treatment
Molded portion LCP resin (UL94V-0) -
Contact and Post Copper alloy Contact portion (main) : Au plating (Min. 0.1 μm) over nickel
Terminal portion: Au plating over nickel (except for top of the terminal)
Ground terminal: Au plating over nickel (except for top of the terminal)

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Rating/Performance
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