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Technology
Introducing MID Solutions
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MID technologies contribute to the creation of added value in a multitude of devices. We offer our proprietary “MIPTEC”, MID (Three-dimensional injection molded circuit component) technologies to form circuits on the surfaces of injection molded components. |
Other technology information
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Strong resistance to various enviroments. For Board to Board and Board to FPC Connection. Narrow-pitch Connector Series F4S, F4, P5KF, P5KS. |
What's New
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April 1, 2013
Package AAM11 Series for Infrared LED Module
Realization of high efficiency package through small and low-profile reflector structure.
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October 30, 2012
We've relaunched our MIPTEC website!
Check out the latest information of the 3D Packaging Technology.
CONTACT US
BY EMAIL
BY EMAIL
Please click your area to select country or region
BY PHONE
- U.S.A.
- +1-800-344-2112
- Europe
- +49-89-45354-1000
- China
- +86-10-59255988
- Singapore
- +65-6299-9181
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