MID technologies contribute to the creation of added value in a multitude of devices.
We offer our proprietary MIPTEC, MID (Three-dimensional injection molded circuit component) technologies to form circuits on the surfaces of injection molded components.
Strong resistance to various enviroments.
For Board to Board and Board to FPC Connection. Narrow-pitch Connector Series F4S, F4, P5KF, P5KS.
April 1, 2020
This website introduce handy information including on Automation Controls-related products and tips contributing to the resolution of issues faced by engineers.
April 1, 2013
Realization of high efficiency package through small and low-profile reflector structure.
October 30, 2012
Check out the latest information of the 3D Packaging Technology.