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Technology introduction

Introducing MID Solutions

MID Solutions

MID technologies contribute to the creation of added value in a multitude of devices.

We offer our proprietary “MIPTEC”, MID (Three-dimensional injection molded circuit component) technologies to form circuits on the surfaces of injection molded components.
We do this through custom orders to meet the diverse needs of our customers who seek “miniaturization”, “feature advancement” and “improve efficiency” in their devices.

MIPTEC 3D Packaging Devices

Other technology information

Strong resistance to various enviroments.

For Board to Board and Board to FPC Connection. Narrow-pitch Connector Series F4S, F4, P5KF, P5KS.

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What's New

April 1, 2020

Pearls of Wisdom on Automation Controls open new window

This website introduce handy information including on Automation Controls-related products and tips contributing to the resolution of issues faced by engineers.

April 1, 2013

Package AAM11 Series for Infrared LED Module

Realization of high efficiency package through small and low-profile reflector structure.

October 30, 2012

We've relaunched our MIPTEC website!

Check out the latest information of the 3D Packaging Technology.


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