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Technology

Introducing MID Solutions

MID technologies contribute to the creation of added value in a multitude of devices.

We offer our proprietary “MIPTEC”, MID (Three-dimensional injection molded circuit component) technologies to form circuits on the surfaces of injection molded components.
We do this through custom orders to meet the diverse needs of our customers who seek “miniaturization”, “feature advancement” and “improve efficiency” in their devices.

MIPTEC 3D Packaging Devices

Application products: MID Package for infrared ray LED module

Other technology information

Strong resistance to various enviroments.

For Board to Board and Board to FPC Connection. Narrow-pitch Connector Series F4S, F4, P5KF, P5KS.

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Cutting-edge Technology Brings the Future Closer

Optics holds the key to advances in the next generation of communications network. Panasonic has the advanced techology and accumulated expertise to fully support the optical-based communications of tomorrow.