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Constructed for high reliability in various environments, these six connectors will make mobile devices tougher than ever.
Tough against droppingHigh contact reliability is a requirement against the shock and vibration that are unavoidable when it comes to use of mobile devices. |
Tough against foreign particles and flux!
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Tough against corrosive gases!Since mobile devices are used in various places, the surrounding gas (car exhaust gas, etc.) and sweat from the human body, can affect the contacting parts. |
Tough against solder rise!Improvements to N2 reflow and lead-free solder flux increase wetting characteristic of solder. Also, due to the miniaturization of connectors, solder rising may occur depending on conditions. |
High precision curved molding that provides the right amount of spring characteristics for contacts, is made possible through precision metal processing, one of our core technologies. A high-level ability to resist shocks has been made possible. The need to withstand the shock of dropping and twisting during insertion has increased in mobile devices. Simulation analysisWe analyzed what the ideal spring shape would be to bring the right spring characteristic to the contact, and then precision molded it using precision metal processing, one of our core technologies. |
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By using the edge for the contacting part, contact pressure per unit area has been increased. Compared to contacts up to now, the ability to remove flux and foreign particles has increased. Also, the ability to prevent entry of foreign particles before it happens has increased.
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![]() Evaluation example of plastic powder adhered on post contact surface |
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This treatment consists of coating surface with a very thin film to seal pinholes in the gold plating. We have developed this porosity treatment technology, which ensures the same contact reliability for thin gold plating as that of thick gold plating.
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Exposed nickel is placed on mid part of socket contacts. This contact, while being low in profile, prevents solder rise.
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