【Notification of Manufacturer Change for Panasonic Industrial Devices SUNX Products and Panasonic Industrial Devices SUNX Tatsuno Products】
From April 1, 2024, the terms "Panasonic Industrial Devices SUNX Co., Ltd." and "Panasonic Industrial Devices SUNX Tatsuno Co., Ltd."
in this page and in the manuals and other documents to be downloaded will all be replaced with "Panasonic Industry Co., Ltd." and applied accordingly.

Business > Industrial Devices > Automation Controls Top > FA Sensors & Components > Sensors > Particular Use Sensors > Hot Melt Glue Detector TH(Discontinued Products) > Specifications

Hot Melt Glue Detector TH (Discontinued Products)

Lineup
CAD data　 Catalogs　 Manuals　 Software
FAQ

We are sorry, the products have been discontinued. Please refer to the details of the discontinued products and the recommended substitutes list below.

	September 30, 2017

Discontinued Products
Information

Specifications

Dimensions

Circuit/ Wiring

Specifications

TH-11CS [Spot type]

Sensor head

Model No.	TH-11
Applicable controller	TH-C1
Sensing range	40 ±10 mm 1.575 ±0.394 in
Sensing object	ø3 mm ø0.118 in or more hot melt glue (emissivity 0.9) at +85 ℃ +185 ℉ or more, under ambient temperature of +25 ℃ +77 ℉ (Note 2)
Ambient temperature	0 to +50 ℃ +32 to +122 ℉ (No dew condensation), Storage: –10 to +60 ℃ +14 to +140 ℉
Visible targeting	Red LED
Material	Enclosure: Polycarbonate, Front cover: Sapphire glass
Weight	Net weight: 77 g approx.
Accessories	MS-TH-1 (Sensor head mounting bracket): 1 set, TH-B1 (Heat shield): 1 pc.

Notes:

1) Where measurement conditions have not been specified precisely, the conditions used were an ambient temperature of +20 ℃ +68 ℉.

2) A hot melt drop at +60 ℃ +140 ℉ or higher can be detected if it is ø5 mm ø0.197 in or more.

1)	Where measurement conditions have not been specified precisely, the conditions used were an ambient temperature of +20 ℃ +68 ℉.
2)	A hot melt drop at +60 ℃ +140 ℉ or higher can be detected if it is ø5 mm ø0.197 in or more.

Controller

Model No.		TH-C1
Applicable sensor head		TH-11
Supply voltage		12 to 24 V DC ±10 % Ripple P-P 10 % or less
Current consumption		100 mA or less
Outputs (OUT 1, OUT 2)		NPN open-collector transistor • Maximum sink current: 100 mA • Applied voltage: 30 V DC or less (between output and 0 V) • Residual voltage: 1 V or less (at 100 mA sink current), 0.4 V or less (at 16 mA sink current)
	Output operation	OUT 1: ON when hot melt adhesive is detected (Max. 1 sec. approx.), OUT 2: ON when the evaluated result is NG (Max. 1 sec. approx.)
Response time (operation freq.)		1 ms or less (1 to 200 Hz)
Warm-up time		40 sec. approx.
Sensitivity setting		Teaching method (Push-button operation)
Level storage function		Sensitivity levels of eight channels can be stored.
External channel select function		Incorporated
Timer function		Incorporated with approx. 40 ms fixed OFF-delay timer, switchable either effective or ineffective
Ambient temperature		0 to +50 ℃ +32 to +122 ℉ (No dew condensation), Storage: –10 to +60 ℃ +14 to +140 ℉
Material		Enclosure: Heat-resistant ABS, Terminal cover: Heat-resistant ABS, Front cover: Polycarbonate
Weight		Net weight: 200 g approx.

Note: Where measurement conditions have not been specified precisely, the conditions used were an ambient temperature of +20 ℃ +68 ℉.

Note:	Where measurement conditions have not been specified precisely, the conditions used were an ambient temperature of +20 ℃ +68 ℉.

TH-12CS TH-12CPS　[Long sensing range type]

Sensor head

Model No.	TH-12
Applicable controller	TH-C2, TH-C2P
Sensing range	10 to 300 mm 0.394 to 11.811 in (Note 2)
Sensing object	ø6 mm ø0.236 in (equivalent to 3 × 10 mm 0.118 × 0.394 in) or more hot melt glue (emissivity 0.9) at +100 ℃ +212 ℉ or more, under ambient temperature of +25 ℃ +77 ℉
Ambient temperature	3 (Industrial environment)
Visible targeting	0 to +50 ℃ +32 to +122 ℉ (No dew condensation), Storage: –10 to +60 ℃ +14 to +140 ℉
Material	Enclosure: Polycarbonate, Indicator: Polycarbonate, Lens: Silicone
Weight	Net weight: 120 g approx.
Accessories	MS-TH-2 (Sensor head mounting bracket): 1 set, TH-B2 (Heat shield): 1 pc., OS-TH12 (Slit mask): 1 pc.

1)	Where measurement conditions have not been specified precisely, the conditions used were an ambient temperature of +20 ℃ +68 ℉.
2)	A hot melt drop at +60 ℃ +140 ℉ or higher can be detected if it is ø5 mm ø0.197 in or more.

Controllers

		NPN output (for TH-12CS)	PNP output (for TH-12CPS)
Model No.		TH-C1	TH-C2P
Applicable sensor head		TH-12
Supply voltage		12 to 24 V DC ±10 % Ripple P-P 10 % or less
Current consumption		100 mA or less
Outputs (OUT 1, OUT 2)		NPN open-collector transistor • Maximum sink current: 100 mA • Applied voltage: 30 V DC or less (between output and 0 V) • Residual voltage: 1 V or less (at 100 mA sink current), 0.4 V or less (at 16 mA sink current)	PNP open-collector transistor • Maximum sink current: 100 mA • Applied voltage: 30 V DC or less (between output and 0 V) • Residual voltage: 2 V or less (at 100 mA source current)
	Utilization category	-	DC-12 or DC-13
	Output operation	OUT 1: ON when hot melt adhesive is detected (Max. 1 sec. approx.), OUT 2: OFF when the evaluated result is NG (Max. 1 sec. approx.)
Response time (operation freq.)		Sensing distance 200 mm 7.874 in or less: 1 ms or less (1 to 200 Hz), Sensing distance 300 mm 11.811 in or less: 1.5 ms or less (1 to 100 Hz)
Warm-up time		40 sec. approx.
Sensitivity setting		Teaching method (Push-button operation)
Level storage function		Sensitivity levels of eight channels can be stored.
External channel select function		Incorporated
Timer function		Incorporated with approx. 40 ms fixed OFF-delay timer, switchable either effective or ineffective
Pollution degree		-	3 (Industrial environment)
Ambient temperature		0 to +50 ℃ +32 to +122 ℉ (No dew condensation), Storage: –10 to +60 ℃ +14 to +140 ℉
EMC		-	EN 60947-5-2
Material		Enclosure: Heat-resistant ABS, Terminal cover: Heat-resistant ABS, Front cover: Polycarbonate
Weight		Net weight: 200 g approx.	Net weight: 140 g approx.