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2.6mm x 1.6mm SMD (EVPBB)

1.DIMENSIONS

EVPBB

(Embossed Taping)


External dimensions

General dimension tolerance: ±0.05
( ) dimensions are reference dimensions.

External dimensions
Part Numbers Operating Force H=Height Operating Life
EVPBB0AAE000 0.7 N 0.5 mm 200,000 cycles
EVPBB1AAE000 1.0 N 0.5 mm 500,000 cycles
EVPBB2A9E000 1.6 N 0.53 mm 500,000 cycles
EVPBB4A9E000 2.4 N 0.55 mm 500,000 cycles
Circuit diagram
Circuit diagram
Stencil mask plan
Stencil mask plan
Land pattern plan

Soldering thickness t=0.08±0.01

Land pattern plan
*Soldering failure may occur depending on applied solder amount, so, please consider to use our recommended stencil and land pattern design.
  : Recommended land pattern area
  : No soldering area
Any land pattern or via holes shall not be provided at area.
If it's necessary to design land pattern or via holes at area, please apply resist to them to protect their metal part completely.
If their metal parts are not protected completely, short circuit failure may occur by solder ball.
Besides, there should be convexoconcave by designing additional pattern, it may cause switch tilt, influence on solder-ability or flux intrusion after reflow soldering.
Therefore, please study any influence of additional land pattern or via holes at area in advance.
CAD Data List

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2.EMBOSSED TAPE DIMENSIONS

Specifications for taping

Part Numbers: EVPBB
Height : 0.50 mm, 0.53 mm, 0.55 mm

Note) Peeling off strength of top tape : It should be within 0.2N to 1.0N at 165 degree in peeling off angle.
Taping condition : Lack of products in the middle of taping should be one MAX, but total quantity specified in the specifications should be secured.
Joint of carrier tape : One joint per one reel may exist.

Unit: mm

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