2.8mm x 2.3mm Side-operational Edge Mount (EVPAV)
1.Dimensions in mm
EVPAVAA1A
- External dimensions
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General dimension tolerance : ± 0.1
( )dimensions are reference dimensions. |
*1 | ✻1 These dimensions are from the outer shape to the center of push plate. |
*2 | ✻2 These dimensions are from the center of datum A. |
*3 | This product is designed to be smaller than the conventional type, which lowered the film peel off strength.
Therefore please avoid to apply force to a push plate from side, or/and avoid set-knob to touch push plate during insertion to a set-case. |
*4 | This reference specifications are subject to change. |
*5 | Height from surface of PCB : 0.975 mm |
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- Circuit Diagram
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- PWB land pattern for reference
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* | Soldering thickness t=0.1±0.02 |
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2.Recommended Reflow Soldering Conditions
- Embossed Carrier Taping
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Taping condition : |
Lack of products in the middle of taping should be one MAX, but total quantity specified in the specifications should be secured. |
Peeling off strength of top tape : |
It should be within 0.2N to 1. ON at 165 degree in peeling off angle. |
Joint of carrier tape : |
One joint per one reel may exist. |
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- Standard Reel Dimensions in mm
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