- Circuit diagram
- Land pattern plan
|The thickness of the solder stencil shall be 0.1 mm, and the opening ratio of the solder stencil to a land pattern shall be 60 to 100 % (recommend 80 %.)
|Soldering failure may occur depending on applied solder amount, so, please consider to use our recommended stencil and land pattern design.
: Recommended land pattern area
: No soldering area
・Any land pattern or via holes shall not be provided at area.
・If it's necessary to design land pattern or via holes at area, please apply resist to them to protect their metal part completely.
・If their metal parts are not protected completely, short circuit failure may occur,
・Besides, there should be convexoconcave by designing additional pattern, it may cause swith tilt, influence on solder-ability or flux intrusion after reflow soldering.
・Therefore, please study any influence of additioan land pattern or via holes at area in advance.