Business > Industrial Devices > Automation Controls Top > Components & Devices > Switches > Tactile Switches (Light Touch Switches) > Tactile Switches (Light Touch Switches) Lineup > 3.0mm x 2.0mm SMD (EVPAW, EVP6A) > Dimensions

3.0mm x 2.0mm SMD (EVPAW, EVP6A)

Lineup
- 2.6mm x 1.6mm SMD Low profile (0.5 to 0.53mm) and Small size (2.6 x 1.6mm). IP67
- 2.8mm x 1.9mm SMD Low profile (0.53mm) and Small size (2.8 x 1.9mm). IP67
- 2.8mm x 2.3mm Side-operational Edge Mount Side operational type with small size and improved soldering strength in operationg direction.
- 3.0mm x 2.0mm SMD Low profile (0.6mm) and Small size (3.0 x 2.0mm). IP67
- 3.0mm x 2.6mm SMD Low profile (0.65mm) and Small size (3.0 x 2.6mm).
- 3.0mm x 2.6mm Double-action SMD Double action with small size.
- 3.4mm x 2.9mm SMD Low profile (0.7mm) and Small size (3.4 x 2.9mm). IP67
- 3.4mm x 1.7mm Side-operational Edge Mount Side operational type with small size and improved soldering strength in operationg direction. IP67
- 3.5mm x 2.9mm SMD High operating force. With a ground terminal type available.
- 3.5mm x 2.9mm Side-operational SMD External dimensions: 3.5 x 2.9mm. Wide variety of terminal shape. Enhanced push plate strength performance.
- 3.5mm x 2.9mm Side-operational Half Dive/SMD Side operational type with low profile. Half dive mount with 0.7mm height from PCB surface.
- 3.8mm x 1.9mm Side-operational SMD Side operational type (External dimensions: 3.9 x 2.05mm). IP67
- 4mm Square SMD External dimensions: 4.1 x 4.1mm. Wide product variety. (With/Without a push plate, and with a ground terminal type available.)
- 4.5mm x 2.2mm Side-operational Edge Mount Side operational type with small size and improved soldering strength in operationg direction. Electrostatic countermeasure performance.
- 4.7mm x 3.5mm SMD High operating force and Long operational life.
- 4.9mm x 4.0mm SMD Achieved Long operation travel 0.23mm with low profile package 0.63mm
- 4.9mm Square SMD External dimensions: 4.9 x 4.9mm. With/Without a push plate type available.
- 6.0mm x 3.5mm External dimensions: 6.0 x 3.5mm. Vertical operational type with snap-in terminals.
- 6.0mm x 3.5mm SMD Surface mount type (External dimensins: 6.0 x 3.5mm).
- 6mm Square Thin Type SMD External dimensions: 6.5 x 6.0mm. With over travel function available.
- 6mm Square Middle Travel SMD Middle travel feeling
- 6mm Square Middle Travel 2 terminals SMD Middle travel type with two terminal structure.
- 6mm Square Long Travel 2R Long travel type with radial tape.
- 6mm Square Long Travel 2 terminals SMD Long travel type with two terminal structure.
- 6mm Square Long Travel SMD External dimensions: 6.0 x 6.1mm. Long travel type.
- 6.2mm x 2.5mm Side-operational Edge Mount Side operational type with small size and improved soldering strength in operationg direction. High operating force performance.
- 8mm Square Long Travel SMD Prevent incorrect operation with high operating force.
- 10 mm Square Center Space Long Travel SMD Center space structure and surface mount type.
- Small-sized Side-operational SMD Side operational type (External dimensions: 4.7 x 3.5mm).
- Over Travel Comfortable for long hours of operation thanks to over travel function.
CAD data　 Catalogs/Datasheets　　
FAQ

Basic Information

Part Number

Rating/Performance

Dimensions

Unit : mm

1.DIMENSIONS
2.EMBOSSED TAPE DIMENSIONS

1.DIMENSIONS

EVPAW
EVP6A

(Embossed Taping)

External dimensions

General dimension tolerance : ± 0.05
( ) dimensions are reference dimensions.

*	This reference specifications are subject to change.

Part Numbers	Operating Force	Height	Operating Life
EVPAWBD40	1.6 N	0.6 mm	500,000 cycles
EVPAWCD40	2.4 N	0.6 mm	500,000 cycles
EVP6AWD40	3.0 N	0.6 mm	300,000 cycles
EVPAWED40	3.3 N	0.6 mm	300,000 cycles

Circuit diagram

Land pattern plan

The thickness of the solder stencil shall be 0.1 mm, and the opening ratio of the solder stencil to a land pattern shall be 60 to 100 % (recommend 80 %.)

Soldering failure may occur depending on applied solder amount, so, please consider to use our recommended stencil and land pattern design.

: Recommended land pattern area

: No soldering area

・Any land pattern or via holes shall not be provided at

area.
・If it's necessary to design land pattern or via holes at

area, please apply resist to them to protect their metal part completely.
・If their metal parts are not protected completely, short circuit failure may occur,
・Besides, there should be convexoconcave by designing additional pattern, it may cause swith tilt, influence on solder-ability or flux intrusion after reflow soldering.
・Therefore, please study any influence of additioan land pattern or via holes at

area in advance.

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2.EMBOSSED TAPE DIMENSIONS

Specifications for taping

Part Numbers: EVPAW, EVP6A
Height: 0.6 mm

Note)	Peeling off strength of top tape	:	It should be within 0.2 N to 1.0 N at 165 degree in peeling off angle.
	Taping condition	:	Lack of products in the middle of taping should be one MAX, but total quantity specified in the specifications should be secured.
	Joint of carrier tape	:	One joint per one reel may exist.