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3.0mm x 2.0mm SMD (EVPAW, EVP6A)

1.DIMENSIONS

EVPAW
EVP6A

(Embossed Taping)


External dimensions

General dimension tolerance : ± 0.05
( ) dimensions are reference dimensions.

External dimensions
*This reference specifications are subject to change.
Part No. Operating Force Height Operating Life
EVPAWBD40 1.6 N 0.6 mm 500,000 cycles
EVPAWCD40 2.4 N 0.6 mm 500,000 cycles
EVP6AWD40 3.0 N 0.6 mm 300,000 cycles
EVPAWED40 3.3 N 0.6 mm 300,000 cycles
Circuit diagram
Circuit diagram
PWB land pattern for reference
Land pattern plan
*The thickness of the solder stencil shall be 0.1 mm, and the opening ratio of the solder stencil to a land pattern shall be 60 to 100 % (recommend 80 %.)
*Soldering failure may occur depending on applied solder amount, so, please consider to use our recommended stencil and land pattern design.

: Recommended land pattern area
: No soldering area

・Any land pattern or via holes shall not be provided at area.
・If it's necessary to design land pattern or via holes at area, please apply resist to them to protect their metal part completely.
・If their metal parts are not protected completely, short circuit failure may occur,
・Besides, there should be convexoconcave by designing additional pattern, it may cause switch tilt, influence on solder-ability or flux intrusion after reflow soldering.
・Therefore, please study any influence of additional land pattern or via holes at area in advance.
CAD Data List

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2.EMBOSSED TAPE DIMENSIONS

Specifications for taping

Part No.: EVPAW, EVP6A
Height: 0.6 mm

Unit: mm

CAD Data List

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