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3.5mm x 2.9mm Side-operational Half Dive/SMD

1.DIMENSIONS

EVPAND
EVPANB

(Embossed Taping)

Straight terminals


External dimensions

General dimension tolerance: ± 0.2
( ) dimensions are reference dimensions.

External dimensions
Circuit diagram
Circuit diagram
PWB land pattern for reference
PWB land pattern for reference
Recommended Solder Mask
Recommended Solder Mask
*In case to much solder pastels applied B mask would be good to resolve the phenomenon.

EVPANDE
EVPANBE

(Embossed Taping)

L-shape terminals


External dimensions

General dimension tolerance: ± 0.2
( ) dimensions are reference dimensions.

External dimensions
Circuit diagram
Circuit diagram
PWB land pattern for reference
PWB land pattern for reference
Recommended Solder Mask
Recommended Solder Mask
*In case to much solder pastels applied B mask would be good to resolve the phenomenon.

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2.EMBOSSED TAPE DIMENSIONS

Specifications for taping

Part Numbers: EVPAN
Height: 1.2 mm

*1Peeling off strength of top tape : It should be within 0.2N to 1.0N at 165 degree in peeling off angle.
*2Taping condition : Lack of products in the middle of taping should be one MAX, but total quantity specified in the specifications should be secured.
*3Joint of carrier tape: One joint per one reel may exist.

Unit: mm

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Related Information

Requests to customers (Automation Control Components & Industrial Device) [Excluding specific product]
Requests to customers (Automation Control Components & Industrial Device) [For specific product]
Requests to customers (FA Sensors & Components [Excluding motors])
Requests to customers (Dedicated to industrial motors)