3.5mm x 2.9mm Side-operational Half Dive SMD (EVPAN)
1.DIMENSIONS
EVPAND
EVPANB
(Embossed Taping)
- External dimensions
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General dimension tolerance: ± 0.2
( ) dimensions are reference dimensions.
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- Circuit diagram
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- PWB land pattern for reference
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- Recommended Solder Mask
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* | In case to much solder pastels applied B mask would be good to resolve the phenomenon. |
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EVPANDE
EVPANBE
(Embossed Taping)
- External dimensions
-
General dimension tolerance: ± 0.2
( ) dimensions are reference dimensions.
|
|
- Circuit diagram
-
|
- PWB land pattern for reference
-
|
- Recommended Solder Mask
-
* | In case to much solder pastels applied B mask would be good to resolve the phenomenon. |
|
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2.EMBOSSED TAPE DIMENSIONS
- Specifications for taping
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Part Numbers: EVPAN
Height: 1.2 mm |
*1 | Peeling off strength of top tape : It should be within 0.2N to 1.0N at 165 degree in peeling off angle. |
*2 | Taping condition : Lack of products in the middle of taping should be one MAX, but total quantity specified in the specifications should be secured. |
*3 | Joint of carrier tape: One joint per one reel may exist. |
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