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DW Relays

DW Relays Cautions for Use

1. For cautions for use, please read “GENERAL APPLICATION GUIDELINES”.

2. Solder and cleaning conditions

1) Flow solder mounting conditions Please obey the following conditions when soldering automatically.

(1) Preheating: within 120°C 248°F (solder surface terminal portion) and within 120 seconds

(2) Soldering iron: 260°C±5°C 500°F±41°F (solder temperature) and within 6 seconds (soldering time)
* Furthermore, because the type of PC board used and other factors may influence the relays, test that the relays function properly on the actual PC board on which they are mounted.

2) Reflow solder mounting (Pin-in-Paste mounting) conditions

T1 = 150 to 180°C 302 to 356°F
T2 = 230°C 446°F or more
T3 = 250°C 482°F or less
t1 = 60 to 120 seconds
t2 = within 30 seconds

• Cautions to observe when mounting temperature increases in the relay are greatly dependent on the way different parts are located a PC board and the heating method of the reflow device.
Therefore, please conduct testing on the actual device beforehand after making sure the parts soldered on the relay terminals and the top of the relay case are within the temperature conditions given above.

3) Since this is not a sealed type relay, do not clean it as is. Also, be careful not to allow flux to overflow above the PC board or enter the inside of the relay.

3. Max. applied voltage

It is not allowed to apply the continuous maximum voltage to the coil.
In order to obtain the specified performance, please apply nominal coil voltage.

4. Set/reset pulse time of latching type relay

Regarding the set/reset pulse time of the latching type relay, it is recommended to apply nominal coil voltage for minimum 30ms pulse across the coil to secure the sure operation considering the ambient temperature and condition change through service life.

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