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> PhotoMOS Cautions for Use
Derating is a significant factor for reliable design and product life. Even if the conditions of use (temperature, current, voltage, etc.) of the product are within the absolute maximum ratings, reliability may be lowered remarkably when continuously used in high load conditions (high temperature, high humidity, high current, high voltage, etc.) Therefore, please derate sufficiently below the absolute maximum ratings and evaluate the device in the actual condition.
Moreover, regardless of the application, if malfunctioning can be expected to pose high risk to human life or to property, or if products are used in equipment otherwise requiring high operational safety, in addition to designing double circuits, that is, incorporating features such as a protection circuit or a redundant circuit, safety testing should also be carried out.
If the voltage or current value for any of the terminals exceeds the absolute maximum rating, internal elements will deteriorate because of the overvoltage or overcurrent. In extreme cases, wiring may melt, or silicon P/N junctions may be destroyed.
Therefore, the circuit should be designed in such a way that the load never exceed the absolute maximum ratings, even momentarily.
For rising and dropping ratio of input voltage (dv/dt), maintain Min. 100 mV/ms.
The oscillation circuit and control circuit of product may be destroyed by external noise, surge, static electricity and so on.
For noise effect to peripheral circuits when oscillation circuit operates, please implement safety measures on the system before use by verifying operation under the actual design.
This phenomenon is generally called static electricity destruction, and occurs when static electricity generated by various factors is discharged while the PhotoMOS® terminals are in contact, producing internal destruction of the element.
To prevent problems from static electricity, the following precautions and measures should be taken when using your device.
The No. 3 terminal is used with the circuit inside the device. Therefore, do not connect it to the external circuitry with either connection method A, B or C. (1 Form A 6-pin type)
Do not short circuit between terminals when device is energized, since there is possibility of breaking of the internal IC.
If reverse surge voltages are present at the input terminals, connect a diode in reverse parallel across the input terminals and keep the reverse voltages below the reverse breakdown voltage.
Typical circuits are below shown.
1. 6-pin | |
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2. Power type | |
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If reverse voltages are present at the input terminals, for example, connect a schottky barrier diode in reverse parallel across the input terminals and keep the reverse voltages below the reverse breakdown voltage. Typical circuit is shown below.
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Design in accordance with the recommended operating conditions for each product.
Since these conditions are affected by the operating environment, ensure conformance with all relevant specifications.
Please keep the LED forward current to within the range given below.
(*Please check the reference data in each catalog for products with maximum ambient temperature (oeprating) over 85°C.)
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For AQV209G, APV1111GV, APV3111GV | |
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If ripple is present in the input power supply, observe the following:
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1. 6-pin | |
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2. Power type | |
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3. CC Type | |
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This product has the capacitor coupled isolation. Therefore, if output waveform fluctuates along the time axis (e.g. AC waveform or pulsating waveform), it may affect the operation of this product and peripheral circuit. Please evaluate the device in the actual condition.
If a continual DC bias will be applied between the input and output, the breakdown voltage of the switching element MOSFET on the output side may degrade. Therefore, be sure to test the product under actual conditions. Example of circuits that will cause degradation of breakdown voltage of MOSFET is given below.
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If you wish to use the product with a connection between input and output, you may not obtain expected performance. Therefore, please be sure to evaluate the device in the actual usage. A circuit example is shown below that may negatively affect PhotoMOS characteristics.
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Cleaning the solder flux should use the immersion washing with an organic solvent. If you have to use ultrasonic cleaning, please adopt the following conditions and check that there are no problems in the actual usage.
* Applies to unit area ultrasonic output for ultrasonic baths
* Excluding high I/O isolation voltage products and SSOP, SON, and TSON packages
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(1) IR (Infrared reflow) soldering method
In case of automatic soldering, following conditions should be observed. (recommended condition reflow: Max. 2 times, measurement point: soldering lead)
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T1 = 150 to 180°C
T2 = 230°C
T3 = 240 to 250°C *
t1 = 60 to 120 s
t2 = Within 30 s
t3 = Within 10 s
* 240 to 245°C for SON, VSSOP and TSON package
(2) Other soldering methods
Other soldering methods (VPS, hot-air, hot plate, laser heating, pulse heater, etc.) affect the PhotoMOS® characteristics differently, please evaluate the device under the actual usage.
(3) Manual soldering method
Temperature: 350 to 400°C, within 3 s, electrical power 30 to 60 W
(1) DWS soldering method
In case of automatic soldering, following conditions should be observed. (recommended condition number of times: Max. 1 time, measurement point: soldering lead *1)
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T1 = 120°C
T2 = Max. 260°C
t1 = within 60 s
t2 + t3 = within 5 s
*1 Solder temperature: Max. 260°C
(2) Other soldering method (recommended condition: 1 time)
Preheating: Max. 120°C, within 120 s, measurement point: soldering lead
Soldering: Max. 260°C, within 10 s, measurement area: soldering temperature
(3) Manual soldering method
Temperature: 350 to 400°C, within 3 s, electrical power 30 to 60 W
For VSSOP type, as shown in the following figure, part of the input and output frames are exposed on the sides of the package. Due to this, please be keep in mind the cautions listed below.
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When several PhotoMOS® are mounted closely each other or heat-generating components are mounted close to the PhotoMOS®, the abnormal heating may occur. This abnormal heat may be caused by the internal element when energized or thermal interference between the devices. The degree of temperature rise depends on the mounting layout of the devices and usage condition, therefore please be sure to use PhotoMOS® with reduced load current after testing under the worst condition of the actual usage.
In case the heat stress of soldering is applied to the PhotoMOS® which absorbs moisture inside of its package, the evaporation of the moisture increases the pressure inside the package and it may cause the package blister or crack. This device is sensitive to moisture and it is packed in the sealed moisture-proof package. Please make sure the following condition after unsealing.
* Please use the device immediately after unsealing.
(Within 30 days at 0 to 30°C and Max. 70% RH)
* If the device will be kept for a long time after unsealing, please store in the another moisture-proof package containing silica gel. (Please use within 90 days.)
Water condensation occurs when the ambient temperature changes suddenly from a high temperature to low temperature at high humidity, or the device is suddenly transferred from a low ambient temperature to a high temperature and humidity. Condensation causes the failures such as insulation deterioration. Panasonic Industry Co., Ltd. does not guarantee the failures caused by water condensation. The heat conduction by the equipment the PhotoMOS® is mounted may accelerate the water condensation. Please confirm that there is no condensation in the worst condition of the actual usage. (Special attention should be paid when high temperature heating parts are close to the PhotoMOS®.)
The distance between the output terminals of this device is short. If foreign matter is caught between the output terminals after mounting on the PC board, it will result in a leakage path. This leakage path increases the leakage current, which results in your product(s) to malfunction. Additionally, the leakage path causes abnormal heat generation and short circuiting, which results in the destruction of your product(s).
Although the absolute maximum load voltage rating is guaranteed for this device, please ensure the prevention of foreign matter on the area between the output terminals and evaluate this device in the most extreme conditions of actual usage.
※Click each figure to enlarge. | mm |
Note: | Note: “ * ” indicates characters of number or alphabet. |
Devices are packaged in a tube so that 1-pin is on the stopper B side. Observe correct orientation when mounting them on PC boards.
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The short circuit protection circuit is designed to protect circuits from excess current. Therefore, surge current may be detected as current overload in which case the output current will be cut and the off state maintained. For this reason, please include the inrush current in the load current and keep it below the maximum load current. Also, in order to maintain stability of internal IC operation, maintain an input current of at least 5 mA (Latch type), 10 mA (Non Latch type).
When two external MOSFETs are connected with a common source terminal, oscillation may occur when operation is restored. Therefore, please insert a 100 to 1,000 ohms resistor between the gate terminal of the first MOSFET and the gate terminal of the second MOSFET.
A typical example of this is given in the circuit below.
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When making PhotoMOS turn on and turn off, please make sure that the LED forward current increases and decreases instantly.
For rising and dropping ratio of input voltage (dv/dt), maintain Min. 100 mV/s.
As a guide in selecting PhotoMOS®, please refer to the following table.
Absolute maximum rating | Recommended load voltage | |||
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Load voltage | Load current | |||
DC type | AQZ102 | 60 V DC | 4.0 A DC | 5, 12, 24 V DC |
AQZ105 | 100 V DC | 2.6 A DC | 48 V DC | |
AQZ107 | 200 V DC | 1.3 A DC | 100 V DC | |
AQZ104 | 400 V DC | 0.7 A DC | 200 V DC | |
AC/DC type | AQZ202 | Peak AC, DC 60 V | Peak AC, DC 3.0 A | 12 V AC 5, 12, 24 V DC |
AQZ205 | Peak AC, DC 100 V | Peak AC, DC 2.0 A | 24 V AC 48 V DC |
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AQZ207 | Peak AC, DC 200 V | Peak AC, DC 1.0 A | 48 V AC 100 V DC |
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AQZ204 | Peak AC, DC 400 V | Peak AC, DC 0.5 A | 120 V AC 200 V DC |
Absolute maximum rating | Recommended load voltage | |||
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Load voltage | Load current | |||
AC/DC type | AQZ404 | Peak AC, DC 400 V | Peak AC, DC 0.5 A | 100 V AC 200 V DC |
Absolute maximum rating | Recommended load voltage | |||
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Load voltage | Load current | |||
DC type | AQZ102D | 60 V DC | 3.6 A DC | 5, 12, 24 V DC |
AQZ105D | 100 V DC | 2.3 A DC | 48 V DC | |
AQZ107D | 200 V DC | 1.1 A DC | 100 V DC | |
AQZ104D | 400 V DC | 0.6 A DC | 200 V DC | |
AC/DC type | AQZ202D | Peak AC, DC 60 V | Peak AC, DC 2.7 A | 12 V AC 5, 12, 24 V DC |
AQZ205D | Peak AC, DC 100 V | Peak AC, DC 1.8 A | 24 V AC 48 V DC |
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AQZ207D | Peak AC, DC 200 V | Peak AC, DC 0.9 A | 48 V AC 100 V DC |
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AQZ204D | Peak AC, DC 400 V | Peak AC, DC 0.45 A | 120 V AC 200 V DC |
Absolute maximum rating | Recommended load voltage | |||
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Load voltage | Load current | |||
DC type | AQZ192 | 60 V DC | 10 A DC | 5, 12, 24 V DC |
AQZ197 | 200 V DC | 5 A DC | 100 V DC | |
AC/DC type | AQZ202G | Peak AC, DC 60 V | Peak AC, DC 6 A | 12 V AC 5, 12, 24 V DC |
AQZ205G | Peak AC, DC 100 V | Peak AC, DC 4 A | 24 V AC 48 V DC |
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AQZ207G | Peak AC, DC 200 V | Peak AC, DC 2 A | 48 V AC 100 V DC |
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AQZ206G2 | Peak AC, DC 600 V | Peak AC, DC 1 A | 120, 240 V AC 200, 400 V DC |
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